MSC8157TAG1000A vs MSC8251SVT1000B Comparación
Comparación detallada lado a lado de MSC8157TAG1000A por NXP Semiconductors y MSC8251SVT1000B por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8157TAG1000A - 6-Core SC3850 DSP, 1GHz, MAPLE-B2 | NXP
MSC8157TAG1000A ⚠ Última compraComparación de especificaciones
| Parámetro | MSC8157TAG1000A | MSC8251SVT1000B |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $178,00 | $65,00 |
| Device Type | Six-core Digital Signal Processor (DSP) | — |
| DSP Architecture | StarCore SC3850 (6x cores) | — |
| Core Frequency | 1 GHz per core | — |
| L1 Instruction Cache | 32 KB per core | 32 KB |
| L1 Data Cache | 32 KB per core | 32 KB |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Accelerator | MAPLE-B2 baseband accelerator | — |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC | — |
| High-Speed Serial I/O | 2x SRIO, 2x PCIe, 2x GbE, 2x CIPRI | — |
| Encapsulado | 783-FCPBGA (29x29 mm) | — |
| Ball Pitch | 1.0 mm | — |
| Temperatura de funcionamiento | -40C to +105C | [DATA_NEEDED: operating temperature grade] |
| Tensión de alimentación | [DATA_NEEDED: core/IO voltage] | — |
| MMU | Yes | — |
| Interrupt Controller | EPIC (Extended Programmable Interrupt Controller) | — |
| Timers | 2x 32-bit general-purpose per core | — |
| Estado RoHS | [DATA_NEEDED] | Compliant |
| Nivel MSL | [DATA_NEEDED] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Architecture | — | SC3850 StarCore, single core |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| L2 Unified Cache | — | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | — | 576 KB |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| PCI Express | — | Yes (integrated controller) |
| Serial RapidIO | — | Yes (SERDES-based) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Tipo de montaje | — | Surface Mount |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |