MSC8251SVT1000B vs MSC8154ETVT1000B Comparison
Detailed side-by-side comparison of MSC8251SVT1000B by NXP Semiconductors and MSC8154ETVT1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8154ETVT1000B ObsoleteSpecification Comparison
| Parameter | MSC8251SVT1000B | MSC8154ETVT1000B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | DSP | DSP |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $65.00 | $171.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Core Architecture | SC3850 StarCore, single core | StarCore SC3850 (quad-core) |
| Core Revision | StarCore R2.1 | — |
| Maximum Core Clock | 1 GHz | — |
| MIPS | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] | — |
| L1 Instruction Cache | 32 KB | 32 KB per core |
| L1 Data Cache | 32 KB | 32 KB per core |
| L2 Unified Cache | 512 KB (configurable, SRAM or MAP) | 512 KB |
| On-Chip RAM | 576 KB | 576 KB |
| Internal ROM | 96 KB | — |
| TDM Interfaces | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support | — |
| Ethernet MAC | Yes (integrated) | — |
| PCI Express | Yes (integrated controller) | — |
| Serial RapidIO | Yes (SERDES-based) | — |
| DMA Controller | Multi-channel DMA | — |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) | — |
| Package Pin Count | 783 balls | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Mounting Type | Surface Mount | — |
| Lead-Free / Halogen-Free | Yes (lead-free, halogen-free package) | — |
| RoHS Status | Compliant | Compliant |
| Operating Temperature | [DATA_NEEDED: operating temperature grade] | — |
| Number of Cores | — | 4 |
| Core Clock Frequency | — | 1 GHz |
| Performance | — | 1000 MIPS per core (4000 MIPS aggregate) |
| On-Chip ROM | — | 96 KB |
| External Memory Interface | — | DDR2/DDR3 controller |
| High-Speed Serial Interfaces | — | Serial RapidIO, PCI Express |
| Ethernet Interfaces | — | 2x RGMII Gigabit Ethernet MACs |
| Peripheral Interfaces | — | I2C, SPI, UART, TDM |
| Security Engine | — | Integrated (IPSec, Kasumi, Snow 3G) |
| Package | — | 783-FCPBGA (29x29 mm) |
| Operating Temperature Grade | — | Industrial |