MSC8251SVT1000B vs MSC8154ETVT1000B 对比
详细并排对比 MSC8251SVT1000B 出自 NXP Semiconductors 和 MSC8154ETVT1000B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8154ETVT1000B Obsolete规格对比
| 参数 | MSC8251SVT1000B | MSC8154ETVT1000B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | DSP | DSP |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $65.00 | $171.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Core Architecture | SC3850 StarCore, single core | StarCore SC3850 (quad-core) |
| Core Revision | StarCore R2.1 | — |
| Maximum Core Clock | 1 GHz | — |
| MIPS | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] | — |
| L1 Instruction Cache | 32 KB | 32 KB per core |
| L1 Data Cache | 32 KB | 32 KB per core |
| L2 Unified Cache | 512 KB (configurable, SRAM or MAP) | 512 KB |
| On-Chip RAM | 576 KB | 576 KB |
| Internal ROM | 96 KB | — |
| TDM Interfaces | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support | — |
| Ethernet MAC | Yes (integrated) | — |
| PCI Express | Yes (integrated controller) | — |
| Serial RapidIO | Yes (SERDES-based) | — |
| DMA Controller | Multi-channel DMA | — |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) | — |
| Package Pin Count | 783 balls | — |
| Package Dimensions | 29 mm x 29 mm | — |
| 安装类型 | Surface Mount | — |
| Lead-Free / Halogen-Free | Yes (lead-free, halogen-free package) | — |
| RoHS 状态 | Compliant | Compliant |
| 工作温度 | [DATA_NEEDED: operating temperature grade] | — |
| Number of Cores | — | 4 |
| Core Clock Frequency | — | 1 GHz |
| Performance | — | 1000 MIPS per core (4000 MIPS aggregate) |
| On-Chip ROM | — | 96 KB |
| External Memory Interface | — | DDR2/DDR3 controller |
| High-Speed Serial Interfaces | — | Serial RapidIO, PCI Express |
| Ethernet Interfaces | — | 2x RGMII Gigabit Ethernet MACs |
| Peripheral Interfaces | — | I2C, SPI, UART, TDM |
| Security Engine | — | Integrated (IPSec, Kasumi, Snow 3G) |
| 封装 | — | 783-FCPBGA (29x29 mm) |
| Operating Temperature Grade | — | Industrial |