MSC8251SVT1000B vs MSC8256SVT1000B Comparison

Detailed side-by-side comparison of MSC8251SVT1000B by NXP Semiconductors and MSC8256SVT1000B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete
NXP Semiconductors
MSC8256SVT1000B MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B Obsolete

Specification Comparison

Parameter MSC8251SVT1000B MSC8256SVT1000B
Brand NXP Semiconductors NXP Semiconductors
Category DSP DSP
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $65.00 $189.00
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors (formerly Freescale)
Core Architecture SC3850 StarCore, single core StarCore SC3850 (VLE, 4-issue)
Core Revision StarCore R2.1 —
Maximum Core Clock 1 GHz —
MIPS [DATA_NEEDED: MIPS rating for 1 GHz SC3850] —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Unified Cache 512 KB (configurable, SRAM or MAP) —
On-Chip RAM 576 KB —
Internal ROM 96 KB —
TDM Interfaces 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support —
Ethernet MAC Yes (integrated) —
PCI Express Yes (integrated controller) —
Serial RapidIO Yes (SERDES-based) —
DMA Controller Multi-channel DMA —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Package Pin Count 783 balls —
Package Dimensions 29 mm x 29 mm —
Mounting Type Surface Mount Surface Mount (BGA)
Lead-Free / Halogen-Free Yes (lead-free, halogen-free package) —
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Operating Temperature [DATA_NEEDED: operating temperature grade] -40C to +105C (industrial)
Series — StarCore MSC8256
Type — SC3850 Six-Core Digital Signal Processor
Number of Cores — 6
Core Clock Speed — 1 GHz
Aggregate Throughput — 1000 MIPS per core (6000 MIPS total)
Data Width — 32-bit / 64-bit
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
Unified L2 Cache (per core) — 512 KB (configurable to M2 memory in 64 KB increments)
On-Chip RAM (total) — 576 KB
Non-Volatile Memory (ROM) — 96 KB
MMU — Yes (hardware memory management unit)
EPIC (Interrupt Controller) — Yes (Extended Programmable Interrupt Controller)
Timers (per core) — 2 x 32-bit general-purpose
DDR Memory Controller — DDR2/DDR3 with ECC
High-Speed Interfaces — Serial RapidIO, PCI Express, SGMII, RGMII
Peripheral Interfaces — I2C, SPI, UART, GPIO
Security Engine — SEC (cryptographic acceleration)
Package — 783-FCBGA (29x29 mm)
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

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