MX25L51245GXDI-08G vs W25M512JVEIQ Comparison
Detailed side-by-side comparison of MX25L51245GXDI-08G by Macronix and W25M512JVEIQ by Winbond. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MX25L51245GXDI-08G | W25M512JVEIQ |
|---|---|---|
| Brand | Macronix | Winbond |
| Category | EEPROM | Memory ICs |
| Lifecycle Status | Active | Active |
| Memory Type | FLASH - NOR Memory IC | FLASH - NOR Memory IC (Multichip Package) |
| Memory Size | 512 Mbit (64 MByte) | 512 Mbit (64 MB) |
| Memory Organization | 64M x 8 | — |
| Technology | FLASH - NOR | — |
| Memory Interface | SPI - Quad I/O, QPI, DTR | — |
| Max Clock Frequency | 166 MHz | 104 MHz |
| Supply Voltage | 2.7 V to 3.6 V | — |
| Operating Temperature | -40C to +85C | [DATA_NEEDED: Operating Temperature range] |
| Write Cycle Time - Word | 60 us | — |
| Write Cycle Time - Page | 750 us | — |
| Endurance | 100,000 cycles | — |
| Data Retention | 20 years | [DATA_NEEDED: Data retention] |
| Package / Case | 24-CSPBGA (6x8) | — |
| Supplier Device Package | 24-CSPBGA (6x8) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Access Time | 8 ns | 7 ns |
| Memory Format | FLASH | — |
| Organization | — | 64M x 8 |
| Interface | — | SPI, Dual SPI, Quad SPI |
| Operating Voltage | — | 3V / 3.3V |
| Sector Size | — | 4KB Uniform Sector |
| Package | — | 8-WSON (8mm x 6mm) with exposed pad |
| Program/Erase Endurance | — | [DATA_NEEDED: Program/Erase cycles] |
| Write Protect | — | Hardware /WP pin |
| Hold Pin | — | /HOLD supported |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| MSL Level | — | [DATA_NEEDED: Moisture Sensitivity Level] |