RTAX2000DL-1CQ352V vs RTAX2000DL-CQ352E Comparison
Detailed side-by-side comparison of RTAX2000DL-1CQ352V by Microchip Technology and RTAX2000DL-CQ352E by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
RTAX2000DL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000DL-1CQ352V ✓ ActiveMicrochip Technology
RTAX2000DL-CQ352E - 2M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
RTAX2000DL-CQ352E ✓ ActiveSpecification Comparison
| Parameter | RTAX2000DL-1CQ352V | RTAX2000DL-CQ352E |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,950.00 | $3,360.00 |
| Family | RTAX-DSP (RTAX2000DL) | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs |
| Equivalent System Gates | 2,000,000 (approx.) | — |
| Logic Cells | 29,568 | — |
| CLBs | 19,712 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) | — |
| Technology | Digital CMOS | Digital CMOS |
| Programming Technology | Antifuse (one-time programmable) | — |
| Radiation Tolerance | Radiation-tolerant (RTAX-DSP) | — |
| Configuration | Live at power-up, no external boot memory | — |
| Speed Grade | -1 | D (standard) |
| Package | CQ352 (352-pin ceramic QFP) | CQFP-352 (Ceramic Quad Flat Pack) |
| Mounting Type | Surface Mount | Surface Mount |
| Application Domain | Space-flight systems | Space-flight systems (radiation tolerant) |
| Special Features | DSP multiply-accumulate blocks (DL variant) | — |
| RoHS Status | [DATA_NEEDED: RoHS Status] | — |
| Operating Temperature | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | — |
| System Gates | — | 2,000,000 |
| Configurable Logic Blocks (CLBs) | — | 19,712 |
| Programmable Type | — | Antifuse (one-time programmable), live at power-up |
| Package Dimensions | — | 48 mm x 48 mm |
| Terminal Pitch | — | 0.50 mm |
| Number of Terminals | — | 352 |
| User Input Terminals | — | 166 |
| User Output Terminals | — | 166 |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clock Features | — | Segmentable clocks, chip-wide highway routing |
| Supply Voltage | — | [DATA_NEEDED: core supply voltage] |