S9S08AW32E5CFGE vs MC9S08AW32CFGE Comparison

Detailed side-by-side comparison of S9S08AW32E5CFGE by NXP Semiconductors and MC9S08AW32CFGE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08AW32E5CFGE S9S08AW32E5CFGE - 8-bit 40MHz 32KB Flash Automotive MCU | NXP

S9S08AW32E5CFGE - 8-bit 40MHz 32KB Flash Automotive MCU | NXP

S9S08AW32E5CFGE ✓ Active
NXP Semiconductors
MC9S08AW32CFGE MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE Nrnd

Specification Comparison

Parameter S9S08AW32E5CFGE MC9S08AW32CFGE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $3.51 $2.86
Core HCS08 (S08) 8-bit —
Maximum CPU Frequency 40 MHz 40 MHz
Program Memory (FLASH) 32 KB (32K x 8) —
RAM 2 KB 2 KB
Data EEPROM [DATA_NEEDED: EEPROM size] —
Package 44-LQFP (10x10 mm) 44-LQFP (10x10 mm), 0.5 mm pitch
Pin Count 44 —
Supply Voltage (VDD) 2.7 V to 5.5 V —
Operating Temperature Grade Industrial / Automotive (AEC-Q100) —
Bus Clock Range [DATA_NEEDED: bus clock min/max] —
ADC On-chip ADC (channels [DATA_NEEDED]) —
Timers/PWM (TPM) On-chip TPM modules —
Communication Interfaces SCI (UART), SPI, IIC —
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant [DATA_NEEDED: RoHS status]
MSL Level MSL3 (per JEDEC J-STD-020) —
Qualification AEC-Q100 (automotive, "S9" prefix) —
Development Tools CodeWarrior HC(S)08, P&E BDM/Cyclone, USBDM —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
Internal Bus Frequency — 20 MHz
Flash Memory — 32 KB (32K x 8)
EEPROM — [DATA_NEEDED: EEPROM size]
Supply Voltage Range — 2.7 V to 5.5 V
ADC Resolution — 10-bit
ADC Channels — 8-channel
General Purpose I/O — 34
Package Standard — MO-220VKKD-2, 7 x 7 mm body variants per distributor listing
Debug Interface — Single-wire background debug mode (BDM)
Instruction Set — HC08 instruction set with added BGND instruction
Operating Temperature — [DATA_NEEDED: operating temperature range]
Lifecycle Status — NRND (Not Recommended for New Designs)

Datasheets & Resources

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