S9S08AW32E5CFGE vs MC9S08AW32CFGE Vergleich

Detaillierter Direktvergleich von S9S08AW32E5CFGE von NXP Semiconductors und MC9S08AW32CFGE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S9S08AW32E5CFGE S9S08AW32E5CFGE - 8-bit 40MHz 32KB Flash Automotive MCU | NXP

S9S08AW32E5CFGE - 8-bit 40MHz 32KB Flash Automotive MCU | NXP

S9S08AW32E5CFGE ✓ Aktiv
NXP Semiconductors
MC9S08AW32CFGE MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE Nrnd

Spezifikationsvergleich

Parameter S9S08AW32E5CFGE MC9S08AW32CFGE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,51 $2,86
Core HCS08 (S08) 8-bit —
Maximum CPU Frequency 40 MHz 40 MHz
Program Memory (FLASH) 32 KB (32K x 8) —
RAM 2 KB 2 KB
Data EEPROM [DATA_NEEDED: EEPROM size] —
Gehäuse 44-LQFP (10x10 mm) 44-LQFP (10x10 mm), 0.5 mm pitch
Pin-Anzahl 44 —
Supply Voltage (VDD) 2.7 V to 5.5 V —
Operating Temperature Grade Industrial / Automotive (AEC-Q100) —
Bus Clock Range [DATA_NEEDED: bus clock min/max] —
ADC On-chip ADC (channels [DATA_NEEDED]) —
Timers/PWM (TPM) On-chip TPM modules —
Communication Interfaces SCI (UART), SPI, IIC —
Montageart Surface Mount Surface Mount
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
MSL-Level MSL3 (per JEDEC J-STD-020) —
Qualification AEC-Q100 (automotive, "S9" prefix) —
Development Tools CodeWarrior HC(S)08, P&E BDM/Cyclone, USBDM —
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
Internal Bus Frequency — 20 MHz
Flash Memory — 32 KB (32K x 8)
EEPROM — [DATA_NEEDED: EEPROM size]
Supply Voltage Range — 2.7 V to 5.5 V
ADC Resolution — 10-bit
ADC Channels — 8-channel
General Purpose I/O — 34
Package Standard — MO-220VKKD-2, 7 x 7 mm body variants per distributor listing
Debug Interface — Single-wire background debug mode (BDM)
Instruction Set — HC08 instruction set with added BGND instruction
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Lebenszyklusstatus — NRND (Not Recommended for New Designs)

Datenblätter & Ressourcen

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