S9S08AW32E5MPUE vs S9S08AW16AE0VLD Comparison

Detailed side-by-side comparison of S9S08AW32E5MPUE by NXP Semiconductors and S9S08AW16AE0VLD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08AW32E5MPUE S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP

S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP

S9S08AW32E5MPUE ✓ Active
NXP Semiconductors
S9S08AW16AE0VLD S9S08AW16AE0VLD - 8-bit MCU, 16KB Flash, 40MHz, Auto QFP-44 | NXP

S9S08AW16AE0VLD - 8-bit MCU, 16KB Flash, 40MHz, Auto QFP-44 | NXP

S9S08AW16AE0VLD ⚠ Last Time Buy

Specification Comparison

Parameter S9S08AW32E5MPUE S9S08AW16AE0VLD
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $3.95 $4.92
Core HCS08 S08 (enhanced 8-bit) —
Core Size 8-bit —
Maximum Clock Frequency 40 MHz —
Program Memory Size 32 KB (32K x 8) Flash —
RAM Size 2 KB (2K x 8) —
Number of I/O Pins 54 —
Package / Case 64-LQFP (10x10 mm) —
Mounting Style SMD/SMT —
Operating Temperature Range -40C to +125C —
Connectivity I2C, SCI (UART), SPI —
On-chip Peripherals LVD, POR, PWM, WDT —
Oscillator Type Internal/External (per datasheet) —
Series S08 / MC9S08AW —
Qualification Automotive (E5 suffix) —
Supply Voltage (typical) [DATA_NEEDED: supply voltage range] —
EEPROM Size Not available on this variant —
Data Bus Width 8-bit —
RoHS Status Compliant Compliant
Core Architecture — HCS08 (8-bit CISC)
CPU Frequency — 40 MHz
Internal Bus Frequency — 20 MHz
Program Memory (Flash) — 16 KB
RAM — 1 KB
Operating Voltage — 2.7 V to 5.5 V
Operating Temperature — -40 °C to +105 °C (Automotive Grade)
Package — 44-LQFP (10x10 mm)
Mounting Type — Surface Mount
ADC — [DATA_NEEDED: ADC resolution and channel count]
Timers — [DATA_NEEDED: timer module count]
Communication Interfaces — SCI (UART), SPI
Debug Interface — Single-wire Background Debug Mode (BDM)
Breakpoint Capability — Single breakpoint during in-circuit debugging
Instruction Set — HC08 instruction set with added BGND instruction
Automotive Qualification — Yes (AEC-Q100 grade implied by -40/+105 °C range and S9 prefix)
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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