S9S08AW32E5MPUE vs S9S08AW16AE0VLD Comparación
Comparación detallada lado a lado de S9S08AW32E5MPUE por NXP Semiconductors y S9S08AW16AE0VLD por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08AW32E5MPUE - Automotive 8-bit MCU, 32KB Flash, 40MHz | NXP
S9S08AW32E5MPUE ✓ ActivoNXP Semiconductors
S9S08AW16AE0VLD - 8-bit MCU, 16KB Flash, 40MHz, Auto QFP-44 | NXP
S9S08AW16AE0VLD ⚠ Última compraComparación de especificaciones
| Parámetro | S9S08AW32E5MPUE | S9S08AW16AE0VLD |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,95 | $4,92 |
| Core | HCS08 S08 (enhanced 8-bit) | — |
| Core Size | 8-bit | — |
| Frecuencia de reloj máxima | 40 MHz | — |
| Program Memory Size | 32 KB (32K x 8) Flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| Number of I/O Pins | 54 | — |
| Encapsulado / Carcasa | 64-LQFP (10x10 mm) | — |
| Estilo de montaje | SMD/SMT | — |
| Rango de temperatura de funcionamiento | -40C to +125C | — |
| Connectivity | I2C, SCI (UART), SPI | — |
| On-chip Peripherals | LVD, POR, PWM, WDT | — |
| Oscillator Type | Internal/External (per datasheet) | — |
| Series | S08 / MC9S08AW | — |
| Qualification | Automotive (E5 suffix) | — |
| Supply Voltage (typical) | [DATA_NEEDED: supply voltage range] | — |
| EEPROM Size | Not available on this variant | — |
| Ancho del bus de datos | 8-bit | — |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | HCS08 (8-bit CISC) |
| CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 16 KB |
| RAM | — | 1 KB |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Temperatura de funcionamiento | — | -40 °C to +105 °C (Automotive Grade) |
| Encapsulado | — | 44-LQFP (10x10 mm) |
| Tipo de montaje | — | Surface Mount |
| ADC | — | [DATA_NEEDED: ADC resolution and channel count] |
| Timers | — | [DATA_NEEDED: timer module count] |
| Communication Interfaces | — | SCI (UART), SPI |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |
| Breakpoint Capability | — | Single breakpoint during in-circuit debugging |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Automotive Qualification | — | Yes (AEC-Q100 grade implied by -40/+105 °C range and S9 prefix) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |