S9S08AW60E5MFGER vs MC9S08AW60CFGE Comparison
Detailed side-by-side comparison of S9S08AW60E5MFGER by NXP Semiconductors and MC9S08AW60CFGE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | S9S08AW60E5MFGER | MC9S08AW60CFGE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6.05 | $0.00 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Supply Voltage | 3 V / 3.3 V / 5 V | — |
| Package | 44-pin LQFP (10 x 10 mm) | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode (BDM) |
| Operating Temperature | -40C to +125C (automotive range) | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | MC9S08AW (S08AW series) |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 general-purpose I/O |
| ADC Resolution | — | 10-bit, 8-channel |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Packaging | — | Tray |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) per NXP |