S9S08AW60E5MFGER vs MC9S08AW60CFGE 对比
详细并排对比 S9S08AW60E5MFGER 出自 NXP Semiconductors 和 MC9S08AW60CFGE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | S9S08AW60E5MFGER | MC9S08AW60CFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.05 | $0.00 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| 电源电压 | 3 V / 3.3 V / 5 V | — |
| 封装 | 44-pin LQFP (10 x 10 mm) | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode (BDM) |
| 工作温度 | -40C to +125C (automotive range) | [DATA_NEEDED: operating temperature range] |
| 安装类型 | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | MC9S08AW (S08AW series) |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-Bit |
| Maximum CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 general-purpose I/O |
| ADC Resolution | — | 10-bit, 8-channel |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Packaging | — | Tray |
| 生命周期状态 | — | NRND (Not Recommended for New Designs) per NXP |