S9S08DZ32F2VLCR vs MC9S08DZ60ACLH Comparison

Detailed side-by-side comparison of S9S08DZ32F2VLCR by NXP Semiconductors and MC9S08DZ60ACLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08DZ32F2VLCR S9S08DZ32F2VLCR - 8-bit S08 MCU, 32KB Flash, CAN, 32-LQFP | NXP

S9S08DZ32F2VLCR - 8-bit S08 MCU, 32KB Flash, CAN, 32-LQFP | NXP

S9S08DZ32F2VLCR ✓ Active
NXP Semiconductors
MC9S08DZ60ACLH MC9S08DZ60ACLH - S08 8-bit MCU 60KB Flash CAN LQFP-64 | NXP

MC9S08DZ60ACLH - S08 8-bit MCU 60KB Flash CAN LQFP-64 | NXP

MC9S08DZ60ACLH Nrnd

Specification Comparison

Parameter S9S08DZ32F2VLCR MC9S08DZ60ACLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $4.20 $5.10
Core S08 (8-bit CISC) HCS08 (8-bit CISC)
Program Flash 32 KB (32K x 8) —
RAM 2 KB —
EEPROM Embedded (on-chip) —
CPU Clock Speed 40 MHz —
Supply Voltage 2.7 V to 5.5 V (3.3 V / 5 V typical) 2.7 V to 5.5 V (3.3 V / 5 V dual)
Operating Temperature -40C to +105C -40 C to +85 C (industrial)
Package 32-LQFP (7x7 mm) 64-LQFP (10x10 mm)
CAN Controller Yes (CAN 2.0 A/B) —
LCD Driver Yes (integrated) —
GPIO (approx.) 26 usable —
Debug Interface Background Debug Mode (BDM) Background Debug Mode (BDM)
AEC-Q100 Qualification Yes (automotive qualified) —
Mounting Type Surface Mount Surface Mount
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status Compliant Compliant
CPU Frequency — 40 MHz CPU / 20 MHz bus
Flash Size — 60 KB (60K x 8)
RAM Size — 2 KB
EEPROM Size — 4 KB
Data Bus Width — 8 bit
Pin Count — 64
ADC — 24-channel, 12-bit, 2.5 us conversion
CAN — 1 x CAN 2.0A/B
SCI (UART) — 2 channels
I2C — 1 channel
SPI — 1 channel
GPIO — 53 I/O pins
PWM — 6-channel timer/PWM

Datasheets & Resources

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