S9S08QD4J2MSC vs MC9S08QG4CFFE Comparison

Detailed side-by-side comparison of S9S08QD4J2MSC by NXP Semiconductors and MC9S08QG4CFFE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ Active
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ End of Life

Specification Comparison

Parameter S9S08QD4J2MSC MC9S08QG4CFFE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Stock Status In Stock In Stock
Unit Price (USD) $1.14 $1.10
Manufacturer NXP Semiconductors —
Core Architecture HCS08 (8-bit, HC08-compatible with BGND) —
CPU Frequency 16 MHz —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 256 bytes —
Package 8-SOIC (0.154", 3.90 mm width) 16-QFN-EP (5x5 mm), QFN EP
Mounting Type Surface Mount Surface Mount
Operating Temperature -40C to +125C (automotive grade) —
AEC-Q100 Qualification Qualified —
Number of Pins 8 —
General-Purpose I/O Pins 4 (plus 1 input-only and 1 output-only pin) —
Supply Voltage [DATA_NEEDED: VDD range] 2.5 V / 3.3 V
ADC On-chip ADC (channel count per datasheet) —
Timers On-chip timer(s) —
Communication SCI/SPI (per datasheet) —
Debug Interface Background Debug Mode (BDM) with breakpoints —
Low-Power Modes STOP and WAIT —
RoHS Status [DATA_NEEDED: RoHS status] —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Maximum Clock Frequency — 20 MHz
Program Memory Size — 4KB (4K x 8) FLASH
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Lifecycle Status — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

Datasheets & Resources

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