S9S08QD4J2MSC vs MC9S08QG4CFFE Vergleich

Detaillierter Direktvergleich von S9S08QD4J2MSC von NXP Semiconductors und MC9S08QG4CFFE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ Aktiv
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Abgekündigt

Spezifikationsvergleich

Parameter S9S08QD4J2MSC MC9S08QG4CFFE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,14 $1,10
Manufacturer NXP Semiconductors —
Core Architecture HCS08 (8-bit, HC08-compatible with BGND) —
CPU Frequency 16 MHz —
Program Memory (Flash) 4 KB (4K x 8) —
RAM 256 bytes —
Gehäuse 8-SOIC (0.154", 3.90 mm width) 16-QFN-EP (5x5 mm), QFN EP
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +125C (automotive grade) —
AEC-Q100 Qualification Qualified —
Anzahl der Pins 8 —
General-Purpose I/O Pins 4 (plus 1 input-only and 1 output-only pin) —
Versorgungsspannung [DATA_NEEDED: VDD range] 2.5 V / 3.3 V
ADC On-chip ADC (channel count per datasheet) —
Timers On-chip timer(s) —
Communication SCI/SPI (per datasheet) —
Debug Interface Background Debug Mode (BDM) with breakpoints —
Low-Power Modes STOP and WAIT —
RoHS-Status [DATA_NEEDED: RoHS status] —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Maximale Taktfrequenz — 20 MHz
Program Memory Size — 4KB (4K x 8) FLASH
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Lebenszyklusstatus — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

Datenblätter & Ressourcen

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