S9S08QD4J2MSCR vs S9S08QD4J1VSC Comparison
Detailed side-by-side comparison of S9S08QD4J2MSCR by NXP Semiconductors and S9S08QD4J1VSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | S9S08QD4J2MSCR | S9S08QD4J1VSC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.55 | $1.31 |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Supply Voltage | 2.7 V to 5.5 V | — |
| Operating Temperature | -40 C to +125 C | -40C to +105C |
| Package | 8-SOIC (0.154 inch, 3.90 mm width) | 8-pin SOIC (SOIC-8) |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | 8-channel 10-bit |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | TPM (16-bit) + MTIM (8-bit) |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| RoHS Status | Compliant | Compliant |
| Core Architecture | — | HCS08 (S08 family) |
| CPU Bit Width | — | 8-bit |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Debug Interface | — | Background debug (single wire) + on-chip breakpoints |
| AEC-Q100 | — | Qualified (automotive) |
| Instruction Set | — | HC08 + BGND |
| MSL Level | — | MSL3 (per SOIC-8 standard) |