S9S08QD4J2MSCR vs S9S08QD4J1VSC Vergleich
Detaillierter Direktvergleich von S9S08QD4J2MSCR von NXP Semiconductors und S9S08QD4J1VSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S08QD4J2MSCR | S9S08QD4J1VSC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,55 | $1,31 |
| Core | HCS08 | — |
| Instruction Set Architecture | CISC (68 HC08 with added BGND) | — |
| Core Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory Type | Flash | — |
| Program Memory Size | 4 KB (4K x 8) | — |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40 C to +125 C | -40C to +105C |
| Gehäuse | 8-SOIC (0.154 inch, 3.90 mm width) | 8-pin SOIC (SOIC-8) |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| I/O Pins | 4 | — |
| ADC | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI | 8-channel 10-bit |
| Timers | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) | TPM (16-bit) + MTIM (8-bit) |
| Debug | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints | — |
| RoHS-Status | Compliant | Compliant |
| Core Architecture | — | HCS08 (S08 family) |
| CPU Bit Width | — | 8-bit |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Debug Interface | — | Background debug (single wire) + on-chip breakpoints |
| AEC-Q100 | — | Qualified (automotive) |
| Instruction Set | — | HC08 + BGND |
| MSL-Level | — | MSL3 (per SOIC-8 standard) |