S9S08SL8F1CTJ vs MC9S08SL16CTJ Comparison
Detailed side-by-side comparison of S9S08SL8F1CTJ by NXP Semiconductors and MC9S08SL16CTJ by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | S9S08SL8F1CTJ | MC9S08SL16CTJ |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1.42 | $1.83 |
| Core Processor | S08 8-bit | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| Maximum Clock Frequency | 40 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| EEPROM | Integrated EEPROM (size [DATA_NEEDED: EEPROM size]) | — |
| RAM Size | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size] |
| ADC Resolution | 10-bit | — |
| LIN Interface | Embedded slave LIN interface controller (SLIC) | — |
| Package | 20-TSSOP (0.173 in, 4.40 mm width) | 20-TSSOP |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40 C to +85 C | [DATA_NEEDED: operating temperature range] |
| Supply Voltage | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Moisture Sensitivity Level (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time at Peak Reflow Temperature | 40 s | — |
| Terminal Finish | Tin (JESD-609 Code e3) | — |
| Process Technology | 0.25 um | — |
| RoHS Status | Compliant | — |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 16KB (16K x 8) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 256 x 8 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 16 |
| Interrupt/Reset Sources | — | Up to 32 |
| Packaging | — | Tube |
| Special Module | — | Embedded Slave LIN Interface Controller (SLIC) |
| Instruction Set | — | HC08 compatible with added BGND instruction |
| Part Status | — | Obsolete |