S9S08SL8F1CTJ vs MC9S08SL16CTJ 对比
详细并排对比 S9S08SL8F1CTJ 出自 NXP Semiconductors 和 MC9S08SL16CTJ 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | S9S08SL8F1CTJ | MC9S08SL16CTJ |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.42 | $1.83 |
| Core Processor | S08 8-bit | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| 最大时钟频率 | 40 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| EEPROM | Integrated EEPROM (size [DATA_NEEDED: EEPROM size]) | — |
| RAM Size | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size] |
| ADC Resolution | 10-bit | — |
| LIN Interface | Embedded slave LIN interface controller (SLIC) | — |
| 封装 | 20-TSSOP (0.173 in, 4.40 mm width) | 20-TSSOP |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40 C to +85 C | [DATA_NEEDED: operating temperature range] |
| 电源电压 | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| 湿敏等级（MSL） | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time at Peak Reflow Temperature | 40 s | — |
| Terminal Finish | Tin (JESD-609 Code e3) | — |
| Process Technology | 0.25 um | — |
| RoHS 状态 | Compliant | — |
| Maximum Clock Speed | — | 40 MHz |
| Program Memory Size | — | 16KB (16K x 8) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 256 x 8 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 16 |
| Interrupt/Reset Sources | — | Up to 32 |
| Packaging | — | Tube |
| Special Module | — | Embedded Slave LIN Interface Controller (SLIC) |
| Instruction Set | — | HC08 compatible with added BGND instruction |
| Part Status | — | Obsolete |