W25Q128JVFIQ-TR vs W25Q128JVFIQ Comparison

Detailed side-by-side comparison of W25Q128JVFIQ-TR by Winbond and W25Q128JVFIQ by Winbond. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter W25Q128JVFIQ-TR W25Q128JVFIQ
Brand Winbond Winbond
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.95 $0.62
Memory Type FLASH - NOR NOR Flash
Memory Format Non-volatile —
Memory Size 128 Mbit (16 MB / 16M x 8) 128 Mbit (16 MB)
Memory Organization 16M x 8 —
Interface Type SPI, Dual SPI, Quad SPI, QPI —
Maximum Clock Frequency 133 MHz (Quad I/O) —
Supply Voltage (VCC) 2.7 V to 3.6 V —
Active Read Current 25 mA (typical at 133 MHz) —
Standby Current 15 uA (typical) —
Sector Size 4 KB uniform 4 KB uniform
Block Erase Sizes 32 KB and 64 KB 32 KB / 64 KB
Page Size 256 bytes 256 bytes
Operating Temperature Range -40C to +85C (industrial) —
Package Type 16-SOIC (0.295 inch / 7.50 mm body width) —
Mounting Type Surface Mount —
MSL Level 3 3
Packaging Tape & Reel (TR) —
RoHS Status Compliant Compliant
Interface — SPI, Dual SPI, Quad SPI, QPI
Clock Frequency (Max) — 133 MHz
Supply Voltage — 2.7 V to 3.6 V
Program/Erase Cycles — 100K cycles per sector (typical)
Data Retention — 20 years (typical)
Access Time (Max) — [DATA_NEEDED: max access time in ns]
Package — 16-SOIC (300 mil)
Operating Temperature — -40 C to +85 C (industrial)
JEDEC Device ID — EFh (Winbond 128 Mbit JV family)
Unique ID Length — 64 bits
Security Registers — 3 x 256-byte OTP

Datasheets & Resources

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