W25Q128JVFIQ vs W25Q128JVFIQ-TR Comparison

Detailed side-by-side comparison of W25Q128JVFIQ by Winbond and W25Q128JVFIQ-TR by Winbond. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter W25Q128JVFIQ W25Q128JVFIQ-TR
Brand Winbond Winbond
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.62 $0.95
Memory Type NOR Flash FLASH - NOR
Memory Size 128 Mbit (16 MB) 128 Mbit (16 MB / 16M x 8)
Interface SPI, Dual SPI, Quad SPI, QPI —
Clock Frequency (Max) 133 MHz —
Supply Voltage 2.7 V to 3.6 V —
Page Size 256 bytes 256 bytes
Sector Size 4 KB uniform 4 KB uniform
Block Erase Sizes 32 KB / 64 KB 32 KB and 64 KB
Program/Erase Cycles 100K cycles per sector (typical) —
Data Retention 20 years (typical) —
Access Time (Max) [DATA_NEEDED: max access time in ns] —
Package 16-SOIC (300 mil) —
Operating Temperature -40 C to +85 C (industrial) —
MSL Level 3 3
RoHS Status Compliant Compliant
JEDEC Device ID EFh (Winbond 128 Mbit JV family) —
Unique ID Length 64 bits —
Security Registers 3 x 256-byte OTP —
Memory Format — Non-volatile
Memory Organization — 16M x 8
Interface Type — SPI, Dual SPI, Quad SPI, QPI
Maximum Clock Frequency — 133 MHz (Quad I/O)
Supply Voltage (VCC) — 2.7 V to 3.6 V
Active Read Current — 25 mA (typical at 133 MHz)
Standby Current — 15 uA (typical)
Operating Temperature Range — -40C to +85C (industrial)
Package Type — 16-SOIC (0.295 inch / 7.50 mm body width)
Mounting Type — Surface Mount
Packaging — Tape & Reel (TR)

Datasheets & Resources

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