XA3S50-4PQG208I vs XA3S50-4PQG208Q Comparison

Detailed side-by-side comparison of XA3S50-4PQG208I by Xilinx and XA3S50-4PQG208Q by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XA3S50-4PQG208I XA3S50-4PQG208Q
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Device Type Spartan-3A automotive field-programmable gate array (FPGA) Field Programmable Gate Array (FPGA)
System Gates 50,000 gates 50,000 gates
Logic Cells 1,728 logic elements 1,728 logic cells
Configurable Logic Blocks 192 CLBs 192 CLBs
Total RAM Bits 73,728 bits —
User I/O 124 I/O —
Maximum Data Rate per I/O 622 Mb/s —
Core Supply Voltage 1.2 V —
I/O Supply Voltage 3.3 V —
FPGA Technology 90 nm —
Package 208-pin PQFP plastic quad flat package 208-pin PQFP
Total Package Pins 208 pins —
Speed Grade -4 —
Temperature Grade Industrial, -40°C to +100°C —
Single-Ended I/O Standards 17 standards 17 standards
Differential I/O Standards 7 standards, including LVDS 7 standards
Digital Termination Digitally controlled termination supported —
Automotive Qualification AEC-Q100 automotive-grade designation reported in verified source data AEC-Q100 qualified
FPGA Family — Spartan-3 XA
Maximum Operating Frequency — 125 MHz
User I/O Pins — 124 I/O
On-Chip RAM — 73,728 bits
Supply Voltage — 1.2 V
Maximum Data Transfer Rate per I/O — 622 Mb/s
Differential I/O Support — LVDS
On-Chip Termination — Digitally Controlled
Package Pin Pitch — 0.50 mm
Terminal Form — Gull wing
Package Shape — Square
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Configuration Memory — [DATA_NEEDED: configuration memory type]
Static Power — [DATA_NEEDED: static power]
Dynamic Power — [DATA_NEEDED: dynamic power]

Datasheets & Resources

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