XC3S400A-4FTG256C vs XC3S400-4FT256C Comparison

Detailed side-by-side comparison of XC3S400A-4FTG256C by AMD and XC3S400-4FT256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S400A-4FTG256C XC3S400-4FT256C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Family Spartan-3A —
Manufacturer AMD (Xilinx) —
System Gates 400,000 400,000 gates
Logic Cells 8,064 —
Block RAM Bits 368,640 —
Block RAM Blocks 20 (18 Kbit each) —
User I/Os 195 —
Dedicated Multipliers 4 (18 × 18-bit signed) [DATA_NEEDED: Dedicated multiplier count]
Digital Clock Managers (DCMs) 4 —
Speed/Grade -4 (commercial) —
Max Internal Clock 770 MHz —
Operating Temperature 0°C to +85°C (commercial) —
Process 90 nm CMOS —
Package 256-FTBGA (FTG256), 17 × 17 mm 256-LBGA
Configuration Modes SPI, BPI, JTAG —
Mounting Type Surface Mount (BGA) Surface Mount
Device Type — Spartan-3 Field Programmable Gate Array (FPGA) IC
Configurable Logic Cells — 8,064 cells
User I/O — 173 I/O
Core Voltage — 1.2 V
Performance Grade — -4 speed grade
Temperature Grade — Commercial
Package Type — FTBGA-256
Terminal Type — Ball
Terminal Count — 256 balls
Logic Family — Spartan-3
RoHS Status — Compliant
Programming Technology — [DATA_NEEDED: Programming technology]
Operating Temperature Range — [DATA_NEEDED: Operating temperature range]
Maximum Operating Frequency — [DATA_NEEDED: XC3S400-4FT256C maximum operating frequency]
I/O Standards — [DATA_NEEDED: Supported I/O standards]
Block RAM — [DATA_NEEDED: Block RAM capacity]

Datasheets & Resources

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