XC3S50-4TQG144C vs XC3S50-4TQG144I Comparison

Detailed side-by-side comparison of XC3S50-4TQG144C by AMD and XC3S50-4TQG144I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S50-4TQG144C XC3S50-4TQG144I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type FPGA Field-Programmable Gate Array (FPGA)
FPGA Family Spartan-3 Spartan-3
System Gates 50,000 gates 50,000 gates
Logic Cells 1,728 cells 1,728 cells
Performance Rating 630 MHz —
Process Technology 90 nm 90 nm
Core Supply Voltage 1.2 V nominal 1.2 V
Operating Supply Voltage Range 1.14 V to 1.26 V —
I/O Count 97 I/O —
Embedded Memory [DATA_NEEDED: embedded memory capacity] —
Package Type 144-lead TQFP 144-TQFP
Mounting Type Surface mount Surface Mount
Operating Junction Temperature Range 0°C to 85°C —
Device Classification Commercial temperature grade —
Configuration Interface [DATA_NEEDED: configuration interface details] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
RoHS Status [DATA_NEEDED: RoHS status] unknown
REACH Status [DATA_NEEDED: REACH status] unknown
Configurable Logic Blocks — 192 CLBs
User I/Os — 97 I/Os
Total Block RAM — 73,728 bits
Core Voltage Range — 1.14 V to 1.26 V
Performance Grade — -4 speed grade
Package Dimensions — 20 mm x 20 mm
Operating Temperature — -40°C to +100°C
Temperature Classification — Industrial-grade
Lead-Free Status — Lead Free

Datasheets & Resources

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