XC3S50-5TQG144C vs XC3S50-4TQG144C Comparison

Detailed side-by-side comparison of XC3S50-5TQG144C by AMD and XC3S50-4TQG144C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S50-5TQG144C XC3S50-4TQG144C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Device Type FPGA FPGA
FPGA Family Spartan-3 Spartan-3
System Gates 50,000 gates 50,000 gates
Logic Cells 1,728 cells 1,728 cells
Logic Blocks 192 blocks —
I/O Count 97 I/O 97 I/O
Maximum Clock Frequency 725 MHz —
Core Supply Voltage 1.2 V 1.2 V nominal
Process Technology 90 nm 90 nm
Package 144-pin TQFP —
Package Code TQ144 —
Lead-Free Status Lead free —
Operating Temperature 0°C to 85°C —
Mounting Type Surface mount Surface mount
Terminal Count 144 terminals —
Terminal Form Gull wing —
Package Shape Square —
Embedded Block RAM [DATA_NEEDED: Embedded block RAM capacity] —
Dedicated Multipliers [DATA_NEEDED: Dedicated multiplier count] —
Configuration Memory [DATA_NEEDED: Configuration memory type and capacity] —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
Performance Rating — 630 MHz
Operating Supply Voltage Range — 1.14 V to 1.26 V
Embedded Memory — [DATA_NEEDED: embedded memory capacity]
Package Type — 144-lead TQFP
Operating Junction Temperature Range — 0°C to 85°C
Device Classification — Commercial temperature grade
Configuration Interface — [DATA_NEEDED: configuration interface details]
I/O Standards — [DATA_NEEDED: supported I/O standards]

Datasheets & Resources

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