XC6SLX100-2FG676I vs XC6SLX100-3FG676C Comparison

Detailed side-by-side comparison of XC6SLX100-2FG676I by AMD and XC6SLX100-3FG676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-2FG676I XC6SLX100-3FG676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 101261 cells 101261 cells
User I/O 480 I/O 480 I/O
Internal Frequency 667 MHz 667 MHz
Speed Grade -2 -3
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V 1.2 V
Package 676-BGA 676-BGA, 19 mm × 19 mm, 0.80 mm pitch
Package Type Flip-chip BGA Lead-free CSBGA
Package Ball Pitch 1.0 mm —
Package Dimensions 27 x 27 mm —
Mounting Type Surface Mount Surface Mount
Operating Temperature Range -40 °C to 100 °C (TJ) —
Technology Node 45 nm —
Programming Technology SRAM configurable FPGA —
Lead-Free Status Lead-free —
RoHS Status [DATA_NEEDED: RoHS compliance] —
REACH Status [DATA_NEEDED: REACH compliance] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Block RAM [DATA_NEEDED: block RAM capacity] —
Application Logic Elements — 15822 ALM
Internal Memory — 4.71 Mbit
Process Technology — 45 nm CMOS
Temperature Grade — Commercial
Operating Temperature — 0°C to 85°C
Programmable Logic Family — Spartan-6 LX
RoHS Compliance — [DATA_NEEDED: RoHS compliance]
REACH Compliance — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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