XC6SLX100-3FG676C - 101261-Cell Spartan-6 LX FPGA | AMD
MPN: XC6SLX100-3FG676C ✓ ActiveXC6SLX100-3FG676C Overview
A field-programmable gate array is a programmable logic device in which configurable logic blocks, block RAM, programmable input/output resources, and dedicated clocking resources implement digital systems. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, sits above simple fixed-function logic, and supports configuration-based adaptation of interfaces, control systems, signal processing, and embedded systems. The Spartan-6 LX family combines a large logic-cell count with block memory and high-speed I/O in a surface-mount BGA package.
Key features of the XC6SLX100-3FG676C include 15822 application logic elements, 101261 register and LUT resources identified for this family member, 4.71 Mbit of internal memory, and 480 user I/O. Its -3 speed designation represents the highest-performance speed grade identified for the Spartan-6 LX family. The commercial suffix C corresponds to the stated 0°C to 85°C operating range, while the 676-ball package supports dense board-level interconnect without using perimeter leads.
The FPGA is fabricated using 45 nm CMOS technology and operates with a 1.2 V core voltage. This process generation supports configurable logic, dedicated block RAM, digital clock management resources, programmable I/O standards, and external memory interfaces. Because FPGA pin multiplexing is design dependent, engineers must confirm each selected I/O standard, voltage bank, clock-capable pin, and configuration pin against the package pinout before finalizing the PCB layout.
Typical uses include industrial automation, industrial networking, embedded control, test and measurement equipment, video processing, high-speed data acquisition, and communications infrastructure. The 480 available I/O positions make the device suitable for parallel sensor interfaces, multiple external memory devices, high-speed transceiver connections, and control systems combining logic with sizable on-chip buffering.
PCB implementation should allocate a continuous ground-reference structure, controlled-decoupling power distribution, and unobstructed access to the device's configuration interface. Validate high-speed I/O return paths and length matching against the selected external memory and transceiver requirements. BGA assembly also requires an appropriate stencil, solder-paste process, and inspection plan because package interconnects cannot be visually inspected after reflow.
This product record combines exact orderable-part characteristics, same-footprint Spartan-6 LX alternatives, parameter comparisons, and practical implementation guidance. It helps engineers separate electrical and temperature-grade choices from package or ordering-suffix differences before requesting a quote for the exact assembled device.
Drop-in alternatives for XC6SLX100-3FG676C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX100-3FG676C (same form factor and footprint) — differing in Package, Package Type, Mounting Type, Speed Grade, Device Type.
XC6SLX100-3FGG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-2FGG676C
✅ Drop-InContact for price
View Datasheet →XC6SLX100-3FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-2FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-L1FG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-3FG676C Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 101261 cells |
| Application Logic Elements | 15822 ALM |
| Internal Memory | 4.71 Mbit |
| User I/O | 480 I/O |
| Internal Frequency | 667 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 45 nm CMOS |
| Speed Grade | -3 |
| Temperature Grade | Commercial |
| Operating Temperature | 0°C to 85°C |
| Package | 676-BGA, 19 mm × 19 mm, 0.80 mm pitch |
| Package Type | Lead-free CSBGA |
| Mounting Type | Surface Mount |
| Programmable Logic Family | Spartan-6 LX |
XC6SLX100-3FG676C lead-free csbga Pin Configuration Guide
Pin configuration for XC6SLX100-3FG676C (lead-free csbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX100-3FG676C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX100-3FG676C is suitable for 6 applications: Industrial Automation and Control, Industrial Networking Gateways, Parallel Data Acquisition, Video and Image Processing, Test and Measurement Instrumentation, Embedded Communications Equipment.
Industrial Automation and Control
The XC6SLX100-3FG676C fits industrial controllers that combine sequencing, parallel I/O, communication links, and local decision logic. Its 101261 logic cells and 480 I/O provide substantial capacity for motion-control state machines, machine interlocks, sensor conditioning paths, and multi-axis timing functions, while 4.71 Mbit of internal memory supports buffering and protocol tables. The 0°C to 85°C commercial rating suits controlled indoor equipment. Designers should keep high-current switching and noisy motor circuitry away from sensitive FPGA banks and route clocks over continuous reference planes.
Recommended
Industrial Networking Gateways
The XC6SLX100-3FG676C is suitable for protocol-conversion and industrial-networking gateways that must terminate multiple interfaces concurrently. The 480 I/O positions allow direct connection to parallel buses, memory devices, control signals, and network PHYs, while the large programmable-logic and memory resources support packet buffering, dual-port RAM, stateful filtering, and hardware-assisted protocol handling. The -3 speed grade supports timing-constrained designs requiring maximum family performance. Validate pin multiplexing, I/O voltage standards, clock topology, and external-memory timing in the selected package ball map.
Recommended
Parallel Data Acquisition
The XC6SLX100-3FG676C can implement parallel ADC capture, digital signal conditioning, and real-time processing because it provides 480 I/O alongside 101261 logic cells. Its 4.71 Mbit internal memory can buffer samples or store coefficients, while the 667 MHz stated internal frequency supports pipelined processing. The 676-BGA package offers extensive signal access, but signal integrity becomes critical at high data rates. Engineers should assign an appropriate I/O standard, keep acquisition traces short, control reference-plane continuity, and verify timing against the external converter and FPGA pin arrangement.
Recommended
Video and Image Processing
The XC6SLX100-3FG676C is well suited to pixel pipelines, image pre-processing, display timing, and parallel video interface logic. Its 101261-cell fabric can host parallel filters, color conversion, frame segmentation, and control state machines, while 480 I/O simplifies connection to sensors, capture devices, and display controllers. The -3 grade is positioned for the highest Spartan-6 LX performance, making it preferable when timing margins are limited. The design must define independent I/O banks carefully and verify source-synchronous clocking, data alignment, and video-standard timing.
Recommended
Test and Measurement Instrumentation
The XC6SLX100-3FG676C can serve as the central programmable engine in analyzers, automated test equipment, waveform-generation systems, and laboratory interfaces. The 101261 logic cells and 4.71 Mbit internal memory support sequencing engines, pattern generation, acquisition buffers, and real-time control, while 480 I/O provide flexible instrument connectivity. The commercial 0°C to 85°C range fits typical bench and rack environments with controlled temperature. For sensitive measurements, separate analog and digital sections, use matched clock distribution, and validate grounding and decoupling around every supply rail.
Recommended
Embedded Communications Equipment
The XC6SLX100-3FG676C supports communications equipment requiring flexible protocol logic, packet processing, and a broad external interface count. Its programmable fabric can implement framing, CRC, channelization, clock recovery assistance, and buffer management, while 480 I/O support parallel data paths and multiple external memories. The 45 nm CMOS Spartan-6 LX implementation combines substantial resources with a 1.2 V core. Design teams should identify dedicated clock-capable pins early, preserve configuration access, and use controlled impedance routing for high-speed links between the FPGA and PHY components.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX100-3FG676C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX100-3FGG676C | XC6SLX100-2FGG676C | XC6SLX100-3FGG676I | XC6SLX100-2FGG676I | XC6SLX100-L1FG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BGA | 676-BGA - same footprint | 676-BGA - same footprint | 676-BGA - same footprint | 676-BGA - same footprint | 676-BGA - same footprint |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 101261 cells | 101261 cells | 101261 cells | 101261 cells | 101261 cells | 101261 cells |
| User I/O | 480 I/O | 480 I/O | 480 I/O | 480 I/O | 480 I/O | 480 I/O |
| Internal Memory | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit | 4.71 Mbit |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -3 | -3 | -2 | -3 | -2 | -1L |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Package Body | 19 mm × 19 mm, 0.80 mm pitch | 19 mm × 19 mm, 0.80 mm pitch | 19 mm × 19 mm, 0.80 mm pitch | 19 mm × 19 mm, 0.80 mm pitch | 19 mm × 19 mm, 0.80 mm pitch | 19 mm × 19 mm, 0.80 mm pitch |
Key Differentiators
- Highest-performance speed selection within the listed Spartan-6 LX 676-BGA options (vs XC6SLX100-2FGG676C)
- Commercial-temperature ordering with the -3 performance grade (vs XC6SLX100-3FGG676I)
- Full 676-ball interface capacity in the same Spartan-6 LX family (vs XC6SLX100-2FG484C)
- Performance-oriented grade rather than the low-power -1L offering (vs XC6SLX100-L1FG676C)
Design Notes
Separate the FPGA core, configuration supply, and I/O-bank supplies exactly as required by the manufacturer datasheet. Place local ceramic decoupling at each supply ball group and use a low-impedance power-plane structure rather than relying on long traces or a single bulk capacitor. Validate voltage sequencing, inrush, and the tolerance of every bank supply against the chosen I/O standard before power-up. Do not infer unused-bank connections from the generic BGA outline.
Assign clock-capable and configuration pins before finalizing the 676-ball layout. Route clocks as controlled-impedance nets over uninterrupted reference planes, avoid stubs and plane splits, and provide symmetrical decoupling to nearby supply balls. For external memory or high-speed interfaces, use the package ball assignments and board-development constraints for each Spartan-6 LX speed and temperature ordering suffix. The absence of a 676-ball package-library entry makes manual manufacturer pin-table verification essential.
Do not treat XC6SLX100-2FG484C as a substitute for the 676-ball target; its ball count and footprint differ even though it belongs to the same FPGA family. Likewise, changing from -3 to -2 or -1L can alter achievable timing, and changing the temperature suffix can change environmental qualification. Approve a substitution only after checking the exact ordering code, package drawing, pin table, timing grade, configuration method, and production temperature requirements.
The 45 nm Spartan-6 LX device can dissipate appreciable dynamic power when many configurable logic blocks, memories, and I/O banks operate simultaneously. Use the manufacturer power-estimation methodology for the actual design and provide uninterrupted copper beneath and around the BGA through the PCB stack-up. Evaluate junction temperature with the actual airflow, board construction, and neighboring heat sources. A generic ambient-temperature estimate alone is insufficient because activity factor and switching density materially affect power.
Compliance Information
The package description identifies the device as lead-free. Separate RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not established.
