XC6SLX100-3FG676C vs XC6SLX100-2FG676I Comparison
Detailed side-by-side comparison of XC6SLX100-3FG676C by AMD and XC6SLX100-2FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX100-3FG676C | XC6SLX100-2FG676I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 101261 cells | 101261 cells |
| Application Logic Elements | 15822 ALM | — |
| Internal Memory | 4.71 Mbit | — |
| User I/O | 480 I/O | 480 I/O |
| Internal Frequency | 667 MHz | 667 MHz |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Process Technology | 45 nm CMOS | — |
| Speed Grade | -3 | -2 |
| Temperature Grade | Commercial | — |
| Operating Temperature | 0°C to 85°C | — |
| Package | 676-BGA, 19 mm × 19 mm, 0.80 mm pitch | 676-BGA |
| Package Type | Lead-free CSBGA | Flip-chip BGA |
| Mounting Type | Surface Mount | Surface Mount |
| Programmable Logic Family | Spartan-6 LX | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Technology | — | 45 nm CMOS |
| Package Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 27 x 27 mm |
| Operating Temperature Range | — | -40 °C to 100 °C (TJ) |
| Technology Node | — | 45 nm |
| Programming Technology | — | SRAM configurable FPGA |
| Lead-Free Status | — | Lead-free |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance] |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| Automotive Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |