XC6SLX16-3CSG324I vs XC6SLX16-2CSG324C Comparison

Detailed side-by-side comparison of XC6SLX16-3CSG324I by AMD and XC6SLX16-2CSG324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX16-3CSG324I XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD

XC6SLX16-3CSG324I - 45nm Spartan-6 FPGA | AMD

XC6SLX16-3CSG324I ✓ Active

Specification Comparison

Parameter XC6SLX16-3CSG324I XC6SLX16-2CSG324C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Manufacturing Technology 45 nm —
Logic Cells 14,579 cells 14,579 cells
Number of LABs/CLBs 1,139 LABs/CLBs —
Total RAM 589,824 bits —
Number of I/O 232 I/Os —
Internal Frequency 667 MHz 667 MHz
Operating Frequency 400 MHz —
Supply Voltage 1.14 V to 1.26 V 1.2 V
Speed Grade -3 -2
Operating Temperature Range -40 °C to 100 °C junction —
Commercial Ambient Temperature 0 °C to 85 °C —
Package 324-ball CSBGA, 19 mm × 19 mm 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484
Ball Pitch 0.80 mm —
Mounting Type Surface mount —
Lead-Free Status Lead free Lead-free package description in retrieved data
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
I/O Count — 232 I/Os
Process Technology — 45 nm
Operating Temperature — 0°C to 85°C
Package Dimensions — 19 mm x 19 mm
Package Pitch — 0.80 mm
Manufacturer — AMD, formerly Xilinx
Pin Count — 324-ball package designation in distributor listing; retrieved specification also states 484 pins
Lifecycle Context — Spartan-6 family described as mature in retrieved cross-reference material
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Halogen-Free Status — [DATA_NEEDED: halogen-free status]
Conflict Minerals Status — [DATA_NEEDED: conflict-minerals status]

Datasheets & Resources

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