XC6SLX16-2CSG324C - 14,579-Cell Spartan-6 LX FPGA | AMD
MPN: XC6SLX16-2CSG324C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.9852 | $7.99 |
| 10 | $7.9852 | $79.85 |
| 100 | $7.9852 | $798.52 |
| 500 | $7.9852 | $3,992.60 |
| 1,000 | $7.9852 | $7,985.20 |
XC6SLX16-2CSG324C Overview
A field-programmable gate array, or FPGA, is a reconfigurable semiconductor that lets engineers implement digital logic functions through programmable configuration rather than a fixed mask set. Within the broader semiconductor hierarchy, an FPGA is a programmable digital logic device that sits alongside microcontrollers, DSPs, and ASICs. It is useful when a design needs parallel hardware, adaptable interfaces, or logic that can be updated after manufacture.
The Spartan-6 LX family combines configurable logic blocks with dedicated block RAM and DSP48 processing resources. The verified product listing identifies 232 I/Os and 14,579 cells, providing a substantial logic surface for control planes, data acquisition, protocol bridges, and embedded signal-processing functions. The -2 suffix denotes the device speed grade, while the CSG324 ordering code identifies the specific 324-ball package variant used by the manufacturer.
The supplied data describes the device as a lead-free 19 mm by 19 mm package with 0.80 mm pitch. One retrieved specification identifies the physical description as CSBGA-484, while the distributor listing identifies the orderable package as 324-LFBGA/CSPBGA; these package descriptions require confirmation against the official ordering information before footprint release. The stated operating temperature range is 0°C to 85°C for the version described by the retrieved datasheet source.
Typical applications include industrial automation, bridging, communications, consumer equipment, and control systems where programmable logic and parallel I/O are valuable. An FPGA can implement multiple interfaces concurrently, while its configurable architecture allows design revisions without changing the physical device. Compared with a fixed-function ASIC, this flexibility is useful for prototypes and evolving systems, although FPGA power, clocking, and configuration requirements must be considered during design.
A key design consideration is confirming the exact package, ball map, voltage requirements, configuration interface, memory resources, and I/O standards against the official AMD Spartan-6 documentation before layout or replacement qualification. This page consolidates verified distributor metadata, pricing references, package information, and drop-in replacement guidance while clearly identifying values that still require manufacturer confirmation.
This information is intended for design comparison and sourcing support rather than certification. Spartan-6 LX devices in a common supported package may be pinout compatible, but engineers must verify the specific speed grade, temperature grade, device variant, package, and intended operating conditions before substitution.
Drop-in alternatives for XC6SLX16-2CSG324C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX16-2CSG324I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX16-3CSG324I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX16-2CSG324
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX16-2CSG324C
✅ Drop-In✓ In Stock
$7.9852 / Unit
View Datasheet →XC6SLX16-2CSG324C
✅ Drop-In✓ In Stock
$7.9852 / Unit
View Datasheet →XC6SLX16-2CSG324C Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 14,579 cells |
| I/O Count | 232 I/Os |
| Internal Frequency | 667 MHz |
| Supply Voltage | 1.2 V |
| Process Technology | 45 nm |
| Speed Grade | -2 |
| Operating Temperature | 0°C to 85°C |
| Package | 324-LFBGA/CSPBGA; retrieved sources also state CSBGA-484 |
| Package Dimensions | 19 mm x 19 mm |
| Package Pitch | 0.80 mm |
| Lead-Free Status | Lead-free package description in retrieved data |
| Manufacturer | AMD, formerly Xilinx |
| Pin Count | 324-ball package designation in distributor listing; retrieved specification also states 484 pins |
| Lifecycle Context | Spartan-6 family described as mature in retrieved cross-reference material |
XC6SLX16-2CSG324C 0.80 mm Pin Configuration Guide
Pin configuration for XC6SLX16-2CSG324C (0.80 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX16-2CSG324C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX16-2CSG324C is suitable for 6 applications: Industrial Automation Controller, Communications Protocol Bridge, Data Acquisition and Signal Conditioning, Video and Image Processing Pipeline, Consumer and Automotive-Style Interface Logic, Test and Measurement Control.
Industrial Automation Controller
XC6SLX16-2CSG324C fits industrial automation when a controller must combine parallel I/O, programmable control logic, and adaptable digital functions in one device. Its retrieved specification lists 14,579 FPGA cells, 232 I/Os, a -2 speed grade, and a 1.2 V supply, giving a designer meaningful parallel-processing capacity for machine sequencing, sensor aggregation, actuator control, and diagnostic logic. The FPGA can be placed between field-level interface circuitry and a communications controller, with timing and I/O standards implemented in the fabric. The main trade-off is that external isolation, protection, level shifting, clocking, and power conditioning remain board-level responsibilities. Verify the exact 0°C to 85°C temperature range and CSG324 ball map before using it in factory equipment.
Recommended
Communications Protocol Bridge
The Spartan-6 LX architecture is suitable for a protocol bridge that must translate between multiple digital interfaces without relying on a fixed-function codec. XC6SLX16-2CSG324C provides 14,579 programmable cells and 232 I/Os, allowing parallel framing logic, FIFO-like buffering, clock-domain coordination, and status monitoring to be implemented concurrently. A practical design would connect external transceivers or PHYs to the FPGA’s I/O banks, then use internal logic to manage packet filtering and timing. The reported 667 MHz internal frequency is a device-level figure and should not be treated as a guaranteed system throughput without timing constraints. Designers must verify clock quality, I/O voltage standards, pin placement, and the selected AMD tool flow before release.
Recommended
Data Acquisition and Signal Conditioning
XC6SLX16-2CSG324C can serve as a digital acquisition front end when multiple sensor signals must be sampled, filtered, timestamped, or routed to a processor. The 232-I/O count provides a substantial interface surface, while the FPGA’s programmable logic allows acquisition timing and data routing to be changed independently of the external ADC or sensor. A typical implementation would use the FPGA to generate sample clocks, capture parallel ADC outputs, perform digital filtering, and buffer results for serial transmission. The -2 speed grade and reported 667 MHz internal frequency provide a performance context, but the actual data rate is limited by the ADC, external memory, clocking, and timing closure. Verify voltage compatibility and pin assignments for the exact source and package documentation.
Recommended
Video and Image Processing Pipeline
The FPGA’s programmable logic makes XC6SLX16-2CSG324C a candidate for pixel transport, timing generation, color or luminance processing, and control functions in an embedded video system. The retrieved 14,579-cell and 232-I/O figures can support parallel pipeline stages and multiple control or status signals, while the 45 nm Spartan-6 LX implementation provides dedicated programmable resources for fixed-function image operations. In a practical design, an external image sensor or video interface supplies pixel data, and the FPGA handles timing, scaling, cropping, or overlay logic before transmitting to a display or processor. Timing must be constrained against the actual video clock, memory interface, and electrical standards. The cited sources do not provide a complete block-RAM or DSP resource breakdown, so capacity should be checked in the official device data.
Recommended
Consumer and Automotive-Style Interface Logic
XC6SLX16-2CSG324C can consolidate interface logic in systems that combine several low-speed or medium-speed digital functions, including control, display, keypad, and peripheral interfaces. Its 232 I/Os allow multiple buses and status signals to be connected without implementing the entire system with fixed-function glue logic. The device is described as a lead-free Spartan-6 LX FPGA, but the supplied data does not establish automotive qualification for the exact MPN. Therefore, it should not be assumed suitable for vehicle safety or harsh-environment requirements without checking the official qualification documentation. For consumer or industrial products, designers should also review power consumption, configuration storage, boot behavior, and whether a smaller FPGA could meet the design with lower cost and power.
Recommended
Test and Measurement Control
XC6SLX16-2CSG324C is a candidate for programmable test and measurement front ends that coordinate stimulus, capture, sequencing, and communication. Its 14,579 FPGA cells and 232 I/Os can support parallel control channels, timing generation, and data routing around external converters or instruments. The reported -2 speed grade and 667 MHz internal frequency should be treated as device-level information, not as a guaranteed instrument bandwidth; actual performance depends on clocking, I/O standards, memory, and timing closure. The 0°C to 85°C temperature description in the retrieved source may suit indoor equipment, but environmental and calibration requirements still need independent evaluation. Before schematic and PCB release, obtain the official CSG324 pinout, power sequencing requirements, and package thermal information.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX16-2CSG324C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX16-2CSG324I | XC6SLX16-3CSG324I | XC6SLX16-2CSG324 |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 324-LFBGA/CSPBGA designation; retrieved source also states CSBGA-484 | CSG324 package family | CSG324 package family | CSG324 package family |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -2 | -2 | -3 | -2 |
| Logic Cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells |
| Special Ordering Feature | C suffix in target MPN; exact commercial-temperature meaning requires official confirmation | I suffix; industrial-temperature candidate | I suffix and -3 speed grade | No C suffix in cited ordering code |
Key Differentiators
- 14,579-cell Spartan-6 LX resource baseline (vs XC6SLX16-3CSG324I)
- 232-I/O integration in a compact CSG324-class package (vs XC6SLX16-2CSG324I)
- Explicit -2 speed-grade ordering (vs XC6SLX16-3CSG324I)
- Spartan-6 LX system integration (vs XC6SLX16-2CSG324)
Design Notes
Use the official AMD Spartan-6 CSG324 package pinout file as the controlling source for land patterns, ball assignments, and power connections. The retrieved results contain conflicting descriptions of 324-LFBGA/CSPBGA versus CSBGA-484, so do not generate a footprint from distributor prose. Confirm package dimensions, ball pitch, pin numbering, and exposed or thermal requirements against the current AMD documentation before fabrication.
Plan the FPGA power rails and decoupling from the official device power specification, not from the single 1.2 V figure in the search results. Place required bulk and high-frequency decoupling capacitors close to the relevant supply balls, provide clean return paths, and isolate noisy external circuits. Estimated: the actual rail current depends on the design, clocking, I/O activity, and configuration state, so no wattage estimate is provided without those inputs.
Do not treat a same-family MPN as an automatic replacement. Confirm that the alternative is a Spartan-6 LX device in the same supported CSG324 package, then compare speed grade, temperature suffix, I/O requirements, configuration method, resource usage, and tool compatibility. AMD support material supports package-level pinout compatibility for appropriate LX devices, but it does not by itself prove regulatory qualification or availability.
Route clocks and high-speed interfaces with controlled topology, and keep configuration pins, power sensing, and debug access accessible for manufacturing. FPGA designs are sensitive to clock jitter, return-current discontinuities, and simultaneous-switching noise. Because the supplied data does not specify speed-grade timing limits or I/O standards, these values must be obtained from the official datasheet and memory-interface documentation before sign-off.
Validate thermal performance at the maximum expected I/O activity and clock conditions rather than relying on a nominal device speed grade. The supplied results provide 45 nm process technology and a 19 mm by 19 mm package description but no verified thermal resistance or power budget. Estimated: junction temperature depends on package construction, PCB copper, airflow, ambient temperature, and design activity, so these inputs are required before estimating temperature rise.
Compliance Information
The retrieved product description uses the phrase lead-free, but the supplied data does not explicitly verify RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals status. Confirm the exact MPN with current AMD documentation and supplier declarations.
