XC6SLX25-2CSG324C vs EP3C25F324C8N Comparison

Detailed side-by-side comparison of XC6SLX25-2CSG324C by AMD and EP3C25F324C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX25-2CSG324C EP3C25F324C8N
Brand AMD Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX FPGA —
Logic Cells 24,051 cells —
Configurable Logic Blocks 1,879 CLBs —
Block RAM 958,464 bits —
User I/O 226 I/O —
Maximum Clock Frequency 667 MHz —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Performance Grade -2 —
Package 324-ball CSPBGA 324-BGA (FineLine)
Package Dimensions 15 mm x 15 mm —
Ball Pitch 0.8 mm —
Mounting Type Surface mount Surface Mount
Embedded Soft Processor MicroBlaze —
Lead-Free Status Lead free —
RoHS Status RoHS compliant Compliant
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Number of DSP Slices [DATA_NEEDED: DSP slice count] —
Number of Clock Management Tiles [DATA_NEEDED: clock management tile count] —
Memory Interface Performance [DATA_NEEDED: memory interface performance] —
Family — Cyclone III
Series — Cyclone III
Logic Elements (LEs) — 24,624
Total Memory Bits — 608,256 bits
Embedded Memory (Kbits) — 608 Kbits
Number of I/O — 215
Supply Voltage - Core — 1.2 V
Operating Temperature — 0 C to +85 C (commercial, suffix C)
Speed Grade — 8
Total RAM Bits — 608,256
Process Node — 60 nm low-power CMOS
Number of Multipliers (18x18) — 66
Number of PLLs — 4

Datasheets & Resources

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