XC6SLX25-2CSG324C vs XC6SLX25-N3CSG324C Comparison

Detailed side-by-side comparison of XC6SLX25-2CSG324C by AMD and XC6SLX25-N3CSG324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX25-N3CSG324C XC6SLX25-N3CSG324C - Spartan-6 FPGA, 24051 Cells | AMD

XC6SLX25-N3CSG324C - Spartan-6 FPGA, 24051 Cells | AMD

XC6SLX25-N3CSG324C ✓ Active

Specification Comparison

Parameter XC6SLX25-2CSG324C XC6SLX25-N3CSG324C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX FPGA —
Logic Cells 24,051 cells 24051
Configurable Logic Blocks 1,879 CLBs —
Block RAM 958,464 bits —
User I/O 226 I/O —
Maximum Clock Frequency 667 MHz —
Process Technology 45 nm CMOS 45nm
Core Supply Voltage 1.2 V 1.2V (1.14V to 1.26V)
Performance Grade -2 —
Package 324-ball CSPBGA 324-LFBGA, CSPBGA (CSG324)
Package Dimensions 15 mm x 15 mm —
Ball Pitch 0.8 mm —
Mounting Type Surface mount Surface Mount
Embedded Soft Processor MicroBlaze —
Lead-Free Status Lead free —
RoHS Status RoHS compliant Compliant
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Number of DSP Slices [DATA_NEEDED: DSP slice count] —
Number of Clock Management Tiles [DATA_NEEDED: clock management tile count] —
Memory Interface Performance [DATA_NEEDED: memory interface performance] —
Family — Spartan-6 LX
Logic Blocks (CLBs) — 1879
User I/O Pins — 226
Total RAM Bits — 958464
DSP48A1 Slices — 38
Operating Junction Temperature — 0°C to 85°C
Configuration Interfaces — JTAG, SPI, BPI
Clock Management — Enhanced Mixed-Mode Clock Management (MMCM)
I/O Standards — SelectIO (LVCMOS, LVDS, etc.)

Datasheets & Resources

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