XC6SLX25-3FGG484C vs XC6SLX100-3FGG484C Comparison

Detailed side-by-side comparison of XC6SLX25-3FGG484C by AMD and XC6SLX100-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX25-3FGG484C XC6SLX25-3FGG484C - 24,051-Cell Spartan-6 FPGA | AMD

XC6SLX25-3FGG484C - 24,051-Cell Spartan-6 FPGA | AMD

XC6SLX25-3FGG484C ✓ Active

Specification Comparison

Parameter XC6SLX25-3FGG484C XC6SLX100-3FGG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Manufacturer AMD / Xilinx —
Device Type Spartan-6 LX field-programmable gate array (FPGA) —
Logic Cell Count 24,051 cells —
User I/O Count 266 I/O —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Package 484-pin FBGA 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free
Package Type FBGA —
Number of Package Balls or Pins 484 —
Programmable Logic Type FPGA —
FPGA Family Spartan-6 LX —
Speed Grade -3 -3 (highest performance)
Mounting Type Surface mount Surface Mount (BGA)
Device Category Programmable logic device —
RoHS Status RoHS compliant Compliant
Lead-Free Status Lead free Lead Free
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Maximum I/O Performance [DATA_NEEDED: maximum I/O performance] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Product Lifecycle Status [DATA_NEEDED: product lifecycle status] —
Family — Spartan-6 LX
Logic Cells — 101,261
System Gates — 4,939,776
User I/O — 326
Block RAM — 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM)
DSP48A1 Slices — 180
Process Node — 45 nm CMOS
Core Voltage (VCCINT) — 1.2 V (nominal)
Operating Temperature — 0 C to +85 C (C grade, commercial)
Internal/Max Frequency — 667 MHz (memory controller; logic Fmax speed-grade dependent)

Datasheets & Resources

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