XC6SLX100-3FGG484C Spartan-6 LX FPGA 101K Cells | AMD Xilinx
MPN: XC6SLX100-3FGG484C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
XC6SLX100-3FGG484C Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic function is defined by the customer after manufacture, rather than at the fab. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, and combine configurable logic blocks (CLBs), programmable routing, dedicated DSP slices, Block RAM, and hardened I/O serializers. Unlike microcontrollers (which execute instructions sequentially), FPGAs perform true parallel datapath operations, making them the preferred choice for high-throughput DSP, packet processing, and custom interface bridging where latency and determinism matter more than raw CPU clock rate.
The XC6SLX100-3FGG484C integrates 180 DSP48A1 slices for fixed- and floating-point acceleration, 4,824 Kbits of Block RAM, four clock management tiles (CMTs) with PLL/DLL, and SelectIO technology supporting voltages from 1.2V to 3.3V. The -3 speed grade delivers the highest Fmax in the Spartan-6 LX family, while the 45 nm process node keeps static power in the milliwatt range compared to older 90/65 nm nodes.
Typical applications include high-volume consumer and industrial designs such as video processing pipelines, motor control, industrial Ethernet bridges, PCIe endpoint controllers (when paired with an external PHY), and digital signage. Designers also use it for custom packet processors in telecom backhaul equipment and as a flexible I/O expander/glue logic replacement for multiple CPLDs on a single board.
When designing with the -3 speed grade, ensure your PCB footprint supports the FGG484 (Pb-free, 1.0 mm pitch, 19 x 19 mm body) BGA land pattern and provide adequate via-in-pad or microvia escape routing. Decoupling must follow the Spartan-6 PCB Design Guide for the VCCINT, VCCAUX, and VCCO rails to meet the -3 timing closure across the full industrial temperature range.
This page synthesizes distributor pricing, verified drop-in same-family and cross-brand Spartan-6 equivalents, and practical board-level design guidance that is not consolidated in the manufacturer datasheet itself.
Drop-in alternatives for XC6SLX100-3FGG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX100-3FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-3FG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX150-3FGG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-3FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-N3FGG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX100-3FGG484C Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LX |
| Logic Cells | 101,261 |
| System Gates | 4,939,776 |
| User I/O | 326 |
| Block RAM | 4,824 Kbits (4824 Kb = ~4824 Kbits total Block RAM) |
| DSP48A1 Slices | 180 |
| Speed Grade | -3 (highest performance) |
| Process Node | 45 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V (nominal) |
| Package | 484-ball FBG (FGG484), 19 x 19 mm, 0.80 mm pitch, Pb-free |
| Operating Temperature | 0 C to +85 C (C grade, commercial) |
| Internal/Max Frequency | 667 MHz (memory controller; logic Fmax speed-grade dependent) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free Status | Lead Free |
XC6SLX100-3FGG484C 484-ball fbg (fgg484), 19 x 19 mm, 0.80 mm pitch, pb-free Pin Configuration Guide
Pin configuration for XC6SLX100-3FGG484C (484-ball fbg (fgg484), 19 x 19 mm, 0.80 mm pitch, pb-free package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX100-3FGG484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX100-3FGG484C is suitable for 7 applications: Industrial Ethernet and Fieldbus Bridges, Multi-Axis Motor Control and Drive Loops, Video Processing and Image Aggregation, Telecom Baseband and Packet Processing, PCIe Endpoint / Custom Accelerator Cards, Custom I/O Expansion and Board Glue Logic Replacement, Aerospace and Defense Form-Fit-Function Replacements.
Industrial Ethernet and Fieldbus Bridges
The XC6SLX100-3FGG484C is widely used as a multi-protocol industrial Ethernet bridge because its 326 user I/O can simultaneously host two RMII/RGMII PHYs and several SPI/UART fieldbus interfaces such as Modbus, PROFIBUS, or CAN. The 180 DSP48A1 slices handle deterministic time-critical protocol state machines at sub-microsecond resolution, while 4,824 Kbits of Block RAM buffers entire TCP/IP frames for inspection. Designers choose the -3 speed grade to comfortably meet 100 Mbit/s cut-through latency budgets. Compared with discrete PHY + MCU solutions, this FPGA consolidates 3-4 chips into one and lets end users re-program the bridge protocol via JTAG without rework.
Recommended
Multi-Axis Motor Control and Drive Loops
The XC6SLX100-3FGG484C runs multi-axis FOC motor loops in software-defined servo drives, where its 180 DSP48A1 slices execute Park/Clarke/PID transforms for up to 6 axes per device at 32 kHz loop rate. The 326 SelectIO pins directly interface incremental encoders, EnDat 2.2 absolute encoders, BISS-C, and Hall sensors without external glue logic. Its parallel fabric can drive PWM outputs with 5 ns resolution for IGBT/SiC inverters up to 100 kHz switching. The Spartan-6 LX -3 grade delivers deterministic timing closure that microcontrollers cannot match at multi-axis loading, which is why industrial servo designers favor this FPGA for high-end drives.
Recommended
Video Processing and Image Aggregation
The XC6SLX100-3FGG484C aggregates 2-4 MIPI-CSI or parallel RGB/YCbCr camera streams into a single processing pipeline for industrial inspection, surveillance NVRs, and digital signage controllers. The 4,824 Kbits of Block RAM frame-buffer line memory and the 180 DSP48A1 slices perform real-time color-space conversion, edge detection, and lens distortion correction at 1080p60. The 326 I/O directly accept sub-LVDS/PECL/CML camera serializer outputs (after an external deserializer). System architects often pair the FPGA with an external HDMI 2.0 transmitter for signage output, achieving a complete video pipeline on a single FPGA.
Recommended
Telecom Baseband and Packet Processing
In telecom backhaul and small-cell baseband designs, the XC6SLX100-3FGG484C implements CPRI line-rate processing, IQ sample routing, and custom MAC/PHY glue logic between baseband ASICs and RF front ends. The 326 SelectIO pins can fan out CPRI or OBSAI data at up to 3.2 Gbps per LVDS pair through SelectIO technology, while the Block RAM and DSP slices implement pipelined correlators and FEC pre/post-processing. The 45 nm low-power process keeps static power near 0.5 W at full fabric utilization - critical for outdoor sealed base-station enclosures.
Recommended
PCIe Endpoint / Custom Accelerator Cards
The XC6SLX100-3FGG484C serves as a PCIe Gen1 x1/x2 endpoint in custom half-size cards, where it implements low-latency DMA engines, custom coprocessors, and protocol offload for industrial PCs and lab instrumentation. Although the Spartan-6 LX does not embed a hard PCIe core, the SelectIO and GTP transceivers (when paired with an external clock-cleaner) achieve deterministic DMA throughput. The 101,261 cells accommodate the PCIe PIPE logic plus a custom user accelerator in one fabric, eliminating the cost of a separate bridge chip.
Recommended
Custom I/O Expansion and Board Glue Logic Replacement
Designers routinely deploy the XC6SLX100-3FGG484C as a 'mega-CPLD' that replaces 4-6 discrete 74LVC series glue-logic chips on densely populated SBCs, carrier cards, and SoM baseboards. The FPGA maps any combination of SPI, I2C, UART, GPIO, PWM, and timer logic, with the -3 speed grade comfortably meeting fan-out timings across 100+ MHz interfaces. Re-programmability via JTAG lets hardware teams re-pin feature assignments per board variant without spinning the PCB - a major cost saver in NPI phase.
Recommended
Aerospace and Defense Form-Fit-Function Replacements
The XC6SLX100-3FGG484C's commercial variant mirrors the Defense-grade XQ Spartan-6Q and Automotive XA Spartan-6Q versions pin-for-pin in the same FGG484 package, simplifying logistics for programs that must transition from commercial to rugged or vice versa. Designers using the standard commercial part during prototyping can field-deploy the Q-grade equivalent without touching the PCB. The same holds for MIL-STD-1553 and ARINC-429 avionics interface cards based on this footprint, where the Spartan-6 LX provides deterministic bus-controller timing.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX100-3FGG484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX100-3FGG484I | XC6SLX100-3FG484I | XC6SLX150-3FGG484C | XC6SLX45-3FGG484I | XC6SLX100-N3FGG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FGG484 (484-ball BGA, Pb-free, 19x19 mm, 0.80 mm pitch) | FGG484 - same | FG484 (non-Pb-free variant, 0.80 mm pitch) | FGG484 - same | FGG484 - same | FGG484 - same |
| Logic Cells | 101,261 | 101,261 (same) | 101,261 (same) | 147,443 (+45%) | 43,661 (-57%) | 101,261 (same) |
| Speed Grade | -3 (highest performance) | -3 (same) | -3 (same) | -3 (same) | -3 (same) | N3 (lead-free + -3 speed grade; pin-to-pin equivalent) |
| Temperature Grade | C (0 to +85 C, commercial) | I (-40 to +100 C, industrial) | I (-40 to +100 C, industrial) | C (0 to +85 C, same) | I (-40 to +100 C, industrial) | C (0 to +85 C, same) |
Key Differentiators
- FGG484 footprint pins common to both commercial and industrial temperature grades (vs XC6SLX100-3FGG484I)
- Same FGG484 footprint across multiple Spartan-6 LX densities (vs XC6SLX150-3FGG484C / XC6SLX45-3FGG484I)
- DSP48A1 slice count exactly matches the LX150 upper tier (vs XC6SLX150-3FGG484C)
- Pb-free FGG balls in commercial temp (vs XC6SLX100-3FG484I)
Design Notes
The FGG484 BGA at 19 x 19 mm with 0.80 mm ball pitch requires via-in-pad (VIP) or microvia escape routing on all layers except ground/power planes. AMD's Spartan-6 PCB Design Guide (UG483) recommends a 0.30 mm (12 mil) laser-drilled microvia under each BGA ball, with a dog-bone fanout only if VIP is unavailable. Estimated: at 0.80 mm pitch, full fanout requires 4-6 routing layers plus 2 reference planes for the central BGA region - confirm your stackup has at least 6 signal layers before commit.
The XC6SLX100-3FGG484C requires three or four low-noise rails: VCCINT (1.2 V core), VCCAUX (1.8 V or 2.5 V auxiliary), VCCO (per-bank I/O, 1.2-3.3 V), and optionally VCC_BATT (battery-backed key storage on LX). Estimated: at typical industrial utilization (~30-40% logic + DSP), VCCINT draws 0.8-1.2 A and VCCAUX draws 50-150 mA; budget 2 A total for the 1.2 V rail with 30% headroom. Place a low-ESR 470 uF bulk cap plus four 4.7 uF X7R bypass caps within 1 inch of BGA-484 power balls, per UG483.
The FGG484 BGA's exposed-die bottom side requires a thermal pad of stitched vias (8-12 vias in a 1.2 mm grid) under the central die footprint to the opposite-side copper pour. Estimated: at 1.0 W total power in still air with no heatsink, theta_JA exceeds 20 C/W, pushing junction-to-ambient at ~20 C rise; for industrial -40 to +100 C ambient operation with -3 speed grade, add a thermal pad or 1.0 oz copper pour on both sides of the central die region. The I-grade (XC6SLX100-3FGG484I) variant is preferred when ambient exceeds 70 C continuously.
Avoid mixing VCCO bank voltages randomly - the Spartan-6 LX VCCO pins must be configured per-bank and must match the I/O standard of every pin in that bank (LVCMOS33, LVDS_25, LVDS, etc.). A common pitfall is driving a 3.3 V output into a bank whose VCCO is 1.8 V, which causes long-term CMOS latch-up. Also note that the -3 speed grade requires tighter process tolerances and is generally $20-30 more expensive than -2; do not over-spec speed grade unless your timing analyzer demands it.
DDR/DDR2/DDR3 memory controller outputs on the Spartan-6 LX require matched-pair length routing within +/-25 ps skew; the GTLs/MCIOs need a 50 ohm characteristic impedance reference stackup. AMD's Spartan-6 Memory Interface Solution (UG416) provides specific byte-lane swapping rules - never re-route across byte lanes to 'improve' routing or signal integrity is compromised. Place the DDR chips on the same layer as the FPGA, as close to the FG balls as possible, with via-stitched reference planes.
Compliance Information
RoHS compliant per AMD product page and DigiKey listing. FGG package suffix denotes Pb-free ball composition. AEC-Q100 not applicable for non-automotive parts - look at the XA6SLX100 automotive-grade variants for AEC-Q100 qualified equivalents.
