XC6SLX25-3FGG484C vs XC6SLX25-3FGG484I Comparison
Detailed side-by-side comparison of XC6SLX25-3FGG484C by AMD and XC6SLX25-3FGG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX25-3FGG484C | XC6SLX25-3FGG484I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Manufacturer | AMD / Xilinx | — |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) | — |
| Logic Cell Count | 24,051 cells | — |
| User I/O Count | 266 I/O | — |
| Process Technology | 45 nm CMOS | 45nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package | 484-pin FBGA | 484-BBGA (23x23 mm) |
| Package Type | FBGA | — |
| Number of Package Balls or Pins | 484 | — |
| Programmable Logic Type | FPGA | — |
| FPGA Family | Spartan-6 LX | — |
| Speed Grade | -3 | -3 (highest performance) |
| Mounting Type | Surface mount | Surface Mount |
| Device Category | Programmable logic device | — |
| RoHS Status | RoHS compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | -40°C ~ 100°C (TJ) |
| Maximum I/O Performance | [DATA_NEEDED: maximum I/O performance] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Product Lifecycle Status | [DATA_NEEDED: product lifecycle status] | — |
| Family | — | Spartan-6 LX |
| Logic Cells | — | 24051 |
| Configurable Logic Blocks (CLBs) | — | 1879 |
| Total RAM Bits | — | 958464 |
| Number of I/O | — | 266 |
| Operating Supply Voltage | — | 1.14 V ~ 1.26 V |
| Internal Frequency | — | 500 MHz |
| Lead Free | — | Yes |
| Number of LABs/CLBs | — | 1879 |