XC6SLX25-3FGG484I - Spartan-6 FPGA 24051 Cells | AMD
MPN: XC6SLX25-3FGG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.32 | $45.32 |
| 10 | $41.87 | $418.70 |
| 100 | $36.54 | $3,654.00 |
| 500 | $32.1 | $16,050.00 |
| 1,000 | $28.75 | $28,750.00 |
Drop-in alternatives for XC6SLX25-3FGG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC6SLX25-3FGG484C
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX25-2FGG484I
β Drop-Inβ In Stock
$17.5 / Unit
View Datasheet βXC6SLX25-N3FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XC6SLX45-3FGG484I
β Drop-Inπ Reference alternative (not in catalog)
XA6SLX25-3FGG484Q
β Drop-Inπ Reference alternative (not in catalog)
LFE5U-25F-6BG256C
β‘ Same Packageπ Reference alternative (not in catalog)
XC6SLX25-3FGG484I Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LX |
| Logic Cells | 24051 |
| Configurable Logic Blocks (CLBs) | 1879 |
| Total RAM Bits | 958464 |
| Number of I/O | 266 |
| Package | 484-BBGA (23x23 mm) |
| Mounting Type | Surface Mount |
| Operating Supply Voltage | 1.14 V ~ 1.26 V |
| Operating Temperature Range | -40Β°C ~ 100Β°C (TJ) |
| Speed Grade | -3 (highest performance) |
| Internal Frequency | 500 MHz |
| Process Technology | 45nm CMOS |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Number of LABs/CLBs | 1879 |
XC6SLX25-3FGG484I Pin Configuration
| Pin A1 | IO_L0P_0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L0N_0 β User I/O bank 0, differential pair N |
| Pin B1 | VCCINT β Core logic supply voltage (1.2V) |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L1P_0 β User I/O bank 0, differential pair P |
| Pin C2 | IO_L1N_0 β User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX β Auxiliary supply voltage (2.5V) |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L2P_0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L2N_0 β User I/O bank 0, differential pair N |
| Pin F1 | VCCO_0 β I/O supply voltage for bank 0 |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC6SLX25-3FGG484I is suitable for 6 applications: Industrial Automation, Telecommunications, Automotive Electronics, Video and Image Processing, Aerospace and Defense, IoT and Edge Computing.
Industrial Automation
The XC6SLX25-3FGG484I is ideal for industrial automation due to its 266 I/O pins and 24,051 logic cells, enabling implementation of motor control, PLC interfaces, and real-time monitoring. Its industrial temperature range (-40Β°C to 100Β°C) ensures reliable operation in harsh factory environments. The FPGA's low power consumption and high-speed performance support deterministic control loops and sensor fusion, making it a cost-effective solution for distributed control systems.
Recommended
Telecommunications
In telecommunications, the XC6SLX25-3FGG484I excels in protocol bridging, packet processing, and signal aggregation. With 958,464 RAM bits and 500 MHz internal frequency, it can handle high-throughput data paths and implement complex state machines. The 266 I/O pins support multiple high-speed interfaces like LVDS and HSTL, enabling seamless connection to PHYs and switches. Its low power footprint is critical for line cards and remote radio heads.
Recommended
Automotive Electronics
The XC6SLX25-3FGG484I is suitable for automotive applications such as infotainment, ADAS, and body control modules. Its industrial temperature range and robust I/O support automotive-grade interfaces like CAN and LIN. The FPGA's reconfigurability allows for over-the-air updates and adaptation to evolving standards. With 24,051 logic cells, it can implement vision processing algorithms and sensor fusion, while the -3 speed grade ensures real-time performance.
Recommended
Video and Image Processing
The XC6SLX25-3FGG484I is well-suited for video and image processing applications, including frame grabbers, video converters, and machine vision systems. Its 958,464 RAM bits can store multiple lines of video data, and the DSP48A1 slices accelerate filtering and transformation algorithms. The 266 I/O pins support parallel video buses and serial interfaces like LVDS, enabling high-bandwidth data transfer. The -3 speed grade ensures real-time processing at high resolutions.
Recommended
Aerospace and Defense
In aerospace and defense, the XC6SLX25-3FGG484I is used in radar processing, secure communications, and flight control systems. Its industrial temperature range and proven reliability make it suitable for harsh environments. The FPGA's reconfigurability allows for mission-specific logic updates, while the 24,051 logic cells provide ample resources for signal processing and encryption. The -3 speed grade supports high-speed data acquisition and real-time control.
Recommended
IoT and Edge Computing
The XC6SLX25-3FGG484I is a powerful choice for IoT gateways and edge computing nodes, where low power and flexibility are key. Its 24,051 logic cells can implement protocol conversion, data aggregation, and local AI inference. The 266 I/O pins connect to various sensors and communication modules, while the 958,464 RAM bits buffer data for efficient processing. The industrial temperature range ensures reliable operation in outdoor or remote installations.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX25-3FGG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX25-3FGG484C | XC6SLX25-2FGG484I | XC6SLX25-N3FGG484I | XC6SLX45-3FGG484I |
|---|---|---|---|---|---|
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 24051 | 24051 | 24051 | 24051 | 43661 |
| Number of I/O | 266 | 266 | 266 | 266 | 316 |
| Total RAM Bits | 958464 | 958464 | 958464 | 958464 | 2080768 |
| Speed Grade | -3 | -3 | -2 | -3 | -3 |
| Operating Temperature Range | -40Β°C to 100Β°C | 0Β°C to 85Β°C | -40Β°C to 100Β°C | -40Β°C to 100Β°C | -40Β°C to 100Β°C |
| Core Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
Key Differentiators
- Highest speed grade (-3) in Spartan-6 LX family (vs XC6SLX25-2FGG484I)
- Industrial temperature range (vs XC6SLX25-3FGG484C)
- Pin-compatible with larger Spartan-6 devices (vs XC6SLX45-3FGG484I)
Design Notes
The XC6SLX25-3FGG484I requires multiple supply rails: VCCINT (1.2V), VCCAUX (2.5V), and VCCO (depending on I/O bank). Use low-ESR ceramic capacitors (100nF and 10uF) placed close to each power pin to minimize noise. Follow the recommended power sequencing: VCCINT, then VCCAUX, then VCCO. Refer to the Spartan-6 FPGA datasheet for detailed decoupling guidelines.
For high-speed designs, maintain controlled impedance for I/O traces (e.g., 50 ohm single-ended, 100 ohm differential). Use ground planes under the FPGA and minimize via stubs. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's PCB design guidelines for the FGG484 package to ensure signal integrity.
The XC6SLX25-3FGG484I can dissipate significant power at high utilization. Ensure adequate airflow or a heatsink if the junction temperature approaches the maximum rating of 100Β°C. Use thermal vias under the exposed pad (if present) to conduct heat to the PCB ground plane. Monitor junction temperature in your design to avoid reliability issues.
Compliance Information
RoHS compliant and lead-free per distributor listings. AEC-Q100 not applicable for standard FPGA; automotive variant XA6SLX25-3FGG484Q is available.
