XC6SLX45-2FG484I vs XC6SLX45-3FG484C Comparison

Detailed side-by-side comparison of XC6SLX45-2FG484I by Xilinx and XC6SLX45-3FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX45-3FG484C XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484C ✓ Active

Specification Comparison

Parameter XC6SLX45-2FG484I XC6SLX45-3FG484C
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type Spartan-6 LX Field Programmable Gate Array (FPGA) Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Cells 43,661 cells 43,661 cells
Number of I/O 316 I/O —
Listed Internal Frequency 500 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Core Operating Voltage 1.2 V —
Device Family Spartan-6 LX —
Speed Grade -2 -3
Temperature Grade Industrial Commercial
Operating Temperature Range -40°C to +100°C (junction temperature) —
Package 484-BBGA 484-BBGA
Mounting Type Surface mount Surface Mount
Package Pitch 0.80 mm —
Package Lead-Free Status Lead free —
Number of Logic Cells in Alternative Comparison 43,661 cells —
Adaptive Logic Modules [DATA_NEEDED: Adaptive Logic Module count] 6,822 ALM
Embedded Memory [DATA_NEEDED: Embedded block RAM capacity] 2.04 Mbit
DSP Resources [DATA_NEEDED: DSP slice count] —
Configuration Memory [DATA_NEEDED: Configuration memory type and capacity] —
RoHS Status [DATA_NEEDED: RoHS compliance status] —
REACH Status [DATA_NEEDED: REACH compliance status] REACH unaffected
AEC-Q100 Status [DATA_NEEDED: AEC-Q100 qualification status] —
User I/O — 316 I/O
Internal Frequency — 500 MHz
Core Supply Voltage — 1.2 V
Operating Temperature — 0 °C to 85 °C
Package Dimensions — 15 mm × 15 mm
Package Ball Pitch — 0.80 mm
Catalog Package Detail — MO-275, CSBGA-324
Catalog Pin Count — 324 pins
Lead-Free Packaging — Lead free

Datasheets & Resources

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