XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD
MPN: XC6SLX45-3FG484C ✓ ActiveXC6SLX45-3FG484C Overview
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, joining CPLDs as a reconfigurable implementation of digital functions. The Spartan-6 LX family combines configurable logic, block RAM, dedicated processing resources, and general-purpose I/O in one device, making it suitable for parallel data acquisition, embedded control, interface bridging, and industrial automation.
Key features include 43,661 configurable logic elements, 316 I/O, 2.04 Mbit of embedded memory, 6,822 adaptive logic modules, and 500 MHz internal frequency. The device uses 45 nm CMOS technology and a nominal 1.2 V supply. Its 484-BBGA package provides a compact 15 mm by 15 mm footprint with a 0.80 mm ball pitch, enabling dense PCB layouts when the BGA routing and assembly requirements are properly controlled.
The Spartan-6 architecture provides a practical balance between programmable logic capacity, memory, I/O, and implementation cost. The -3 grade is intended to provide stronger timing performance than the lower -2 and -1L speed grades, although system-level timing still depends on the selected clocking, I/O standards, speed grade, and device utilization. The commercial-grade part is intended for environments where the listed 0 °C to 85 °C operating range is sufficient.
Typical uses include industrial automation controllers, data-acquisition systems, video and image processing, communications infrastructure, embedded signal processing, and general-purpose bridging between parallel buses or proprietary peripherals. The large I/O count supports designs requiring numerous external connections, while the internal logic and memory resources allow multiple functions to be consolidated into one programmable device.
The primary design constraint is the 484-BBGA package. A PCB redesign is generally unavoidable when moving from a leaded package, and reliable assembly requires suitable pad geometry, via-in-pad or via-away routing, adequate solder mask definition, and careful power and ground-plane distribution. Differential and high-speed interface constraints must also be checked against the appropriate Xilinx Spartan-6 package and pinout files before layout signoff.
This page consolidates the verified catalog and cross-reference information, compares pin-compatible same-family options, and highlights BGA implementation considerations. It is intended to support engineering selection and procurement review without treating family variants as interchangeable unless their speed grade, temperature class, package, and device resources have been checked.
Drop-in alternatives for XC6SLX45-3FG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX45-3FG484C (same form factor and footprint) — differing in Device Type, Operating Temperature, Speed Grade, Logic Cells, Package.
XC6SLX45-3FGG484C
✅ Drop-InContact for price
View Datasheet →XC6SLX45-3FG484I
✅ Drop-InContact for price
View Datasheet →XC6SLX45-2FG484C
✅ Drop-InContact for price
View Datasheet →XC6SLX45-2FG484I
✅ Drop-InContact for price
View Datasheet →XC6SLX45T-3FG484C
✅ Drop-InContact for price
View Datasheet →XC6SLX45-3FG484C Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells |
| Adaptive Logic Modules | 6,822 ALM |
| Embedded Memory | 2.04 Mbit |
| User I/O | 316 I/O |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -3 |
| Temperature Grade | Commercial |
| Operating Temperature | 0 °C to 85 °C |
| Package | 484-BBGA |
| Package Dimensions | 15 mm × 15 mm |
| Package Ball Pitch | 0.80 mm |
| Catalog Package Detail | MO-275, CSBGA-324 |
| Catalog Pin Count | 324 pins |
| Mounting Type | Surface Mount |
| Lead-Free Packaging | Lead free |
| REACH Status | REACH unaffected |
XC6SLX45-3FG484C mo-275, csbga-324 Pin Configuration Guide
Pin configuration for XC6SLX45-3FG484C (mo-275, csbga-324 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX45-3FG484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX45-3FG484C is suitable for 6 applications: Industrial Automation Controllers, Data Acquisition Systems, Communications Interface Bridging, Video and Image Processing, Embedded Signal Processing, Custom Instrumentation and Test Equipment.
Industrial Automation Controllers
The XC6SLX45-3FG484C fits industrial automation designs requiring parallel control logic, numerous external connections, and deterministic programmable resources. Its 43,661 logic cells can implement control loops, state machines, protocol handling, and supervisory logic, while 316 I/O provide substantial connectivity to sensors, actuators, field buses, and human-interface modules. The 2.04 Mbit of embedded memory is useful for buffering samples, storing packet data, and supporting local data-processing pipelines. The device's 500 MHz internal frequency provides timing headroom for parallel architectures, although external interface timing must be evaluated at the selected -3 speed grade. For deployments operating above 85 °C, an industrial-temperature family option should be selected instead.
Recommended
Data Acquisition Systems
The XC6SLX45-3FG484C is suitable for parallel data-acquisition systems because its 43,661 logic cells can support multiple acquisition channels, digital filtering, triggering, and data-format conversion. The 2.04 Mbit of embedded memory allows limited on-chip buffering between acquisition and processing stages, reducing pressure on external RAM when the working set is known at design time. With 316 I/O, the FPGA can connect logic to multiple converters, clocks, status signals, and communication transceivers. The 500 MHz internal frequency supports high-rate digital pipelines, but analog sampling accuracy, clock jitter, input thresholds, and output timing require complete board-level verification.
Recommended
Communications Interface Bridging
The XC6SLX45-3FG484C can bridge mismatched communication interfaces by combining protocol converters, packet processing, buffering, and physical-interface control in one programmable device. Its 43,661 logic cells provide capacity for parallel framing logic and multiple state machines, while 2.04 Mbit of embedded memory can absorb short bursts or implement FIFO-based flow control. The 316 available I/O are valuable for parallel buses, clock domains, and simultaneous interfaces. Designers should use the official Spartan-6 package files to confirm every ball location and then apply source-synchronous routing constraints to high-speed interfaces. The -3 grade offers more timing headroom than -2 alternatives.
Recommended
Video and Image Processing
The XC6SLX45-3FG484C supports parallel video and image-processing pipelines where parallel pixels, timing signals, and control data require substantial programmable logic. The 43,661 logic cells can implement filtering, color conversion, pixel packing, thresholding, and synchronization stages, while embedded memory supports line buffers, frame stores, or compact lookup structures depending on image resolution. Its 316 I/O allow connection to image sensors, display links, and supporting control logic. The 500 MHz internal frequency is relevant to pixel-clock processing, although achievable resolution and frame rate depend on resource utilization, memory bandwidth, timing closure, and external memory performance.
Recommended
Embedded Signal Processing
The XC6SLX45-3FG484C is appropriate for fixed-function signal-processing pipelines that benefit from parallel implementation, including filtering, modulation, correlation, and spectral processing. Its 43,661 logic cells allow multiple arithmetic pipelines to operate in parallel, while 2.04 Mbit of embedded memory can support coefficient storage, circular buffers, and sample windows. The -3 speed grade and 500 MHz internal frequency provide useful timing headroom for multicycle and pipelined DSP architectures. The LXT alternative is worth comparing when the design benefits from dedicated DSP-oriented resources, but engineers must confirm actual resource compatibility and complete timing analysis before changing the device.
Recommended
Custom Instrumentation and Test Equipment
The XC6SLX45-3FG484C is useful in custom instrumentation where sequencing, stimulus generation, real-time analysis, and user-defined interfaces must be integrated in a compact system. Its 43,661 logic cells provide room for parallel test-vector logic, measurement pipelines, and control sequences, while 316 I/O support instrument buses, triggers, clock distribution, and display or communications peripherals. Embedded memory can hold calibration tables, test patterns, or captured blocks without requiring a separate controller. Because the catalog data reports a 484-BBGA package, the instrumentation designer should plan for advanced assembly, careful power delivery, and thermal analysis as part of the instrument's mechanical and manufacturing design.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX45-3FG484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX45-3FGG484C | XC6SLX45-3FG484I | XC6SLX45-2FG484C | XC6SLX45-2FG484I | XC6SLX45T-3FG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT |
| Speed Grade | -3 | -3 | -3 | -2 | -2 | -3 |
| Temperature Suffix | C - Commercial | Commercial-grade ordering variant | I - Industrial | C - Commercial | I - Industrial | C - Commercial |
| Operating Temperature | 0 °C to 85 °C | Commercial-grade ordering variant | Industrial temperature grade | 0 °C to 85 °C | Industrial temperature grade | Commercial-grade ordering variant |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| User I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O | 316 I/O | 296 I/O |
| Embedded Memory | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit |
Key Differentiators
- Closest ordering-code match (vs XC6SLX45-3FGG484C)
- Commercial temperature availability (vs XC6SLX45-3FG484I)
- Higher performance speed grade (vs XC6SLX45-2FG484C)
- Broader LX I/O complement (vs XC6SLX45T-3FG484C)
Design Notes
Treat the 484-BBGA as a high-density assembly constraint rather than a conventional leaded-package drop-in. Use the official AMD package drawing and pinout file to establish the exact land pattern, ball map, and exposed or power-ball arrangement. Provide uninterrupted reference planes for core and I/O supplies, minimize loop area in decoupling paths, and validate the selected assembly process with the package vendor.
Check the exact Spartan-6 package files before assigning pins. The verified catalog data uses both a 484-BBGA designation and a 324-pin CSBGA-324 package description, so designers must not infer a ball map from the MPN suffix. Confirm every ball location, power sequence, configuration pin, clock input, and I/O standard in AMD documentation, then run signal-integrity and timing analysis on the actual PCB implementation.
Do not treat -2 and -3 speed-grade variants as automatically interchangeable in an already released design. A lower speed grade can reduce timing margin, while an I-suffix temperature option changes environmental qualification rather than just the ordering code. Re-run synthesis, placement, routing, and static timing analysis whenever the exact MPN, package suffix, speed grade, or temperature class changes.
Compliance Information
The verified catalog data identifies the package as lead free and lists the part as REACH unaffected. RoHS, halogen-free, and conflict-minerals declarations were not present in the supplied data.