XC6SLX45-2FG676I vs XC6SLX45-2FGG676I Comparison

Detailed side-by-side comparison of XC6SLX45-2FG676I by AMD and XC6SLX45-2FGG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-2FG676I XC6SLX45-2FGG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array (FPGA) —
Logic Cells 43,661 cells 43,661
I/O Count 358 I/O —
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Speed Grade -2 -2
Temperature Grade Industrial —
Package 676-BGA 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch
Package Type BGA —
Number of Terminals 676 —
Package Shape Square —
Terminal Form Ball —
Programmable Logic Type FPGA —
Manufacturer AMD / Xilinx —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Block RAM [DATA_NEEDED: block RAM capacity] 2,088 Kbit
DSP Resources [DATA_NEEDED: DSP resource count] —
Family — Spartan-6 LX
Part Number — XC6SLX45-2FGG676I
Configurable Logic Blocks (CLBs) — 3,411
Total Flip-Flops — 54,576
DSP48A1 Slices — 58
User I/Os — 358
Number of I/O Banks — 4
Core Voltage — 1.2 V
Internal Frequency — 500 MHz
Operating Temperature (Industrial) — -40 °C to +100 °C
Process Technology — 45 nm CMOS
Compliance — RoHS compliant, Lead Free

Datasheets & Resources

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