XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD
MPN: XC6SLX45-2FGG676I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $89.5 | $895.00 |
| 100 | $79 | $7,900.00 |
| 500 | $68.4 | $34,200.00 |
| 1,000 | $62.15 | $62,150.00 |
| 2,500 | $55.8 | $139,500.00 |
XC6SLX45-2FGG676I Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and embedded DSP/memory resources that engineers can reconfigure in-circuit to implement custom digital hardware. Within the programmable-logic hierarchy, the Spartan-6 LX family sits between hardened ASICs and small CPLDs, delivering a balance of logic density, DSP performance, and cost optimized for high-volume applications such as consumer, industrial, and automotive driver systems.
Key technical resources include 54,576 flip-flops, 58 DSP48A1 slices for high-throughput arithmetic, four clock-management tiles (CMTs) with internal frequency support up to 500 MHz, and integrated memory controller blocks (MCBs) capable of DDR/DDR2/DDR3/LPDDR interfaces. The -2 speed grade balances performance and power, while the “I” suffix denotes the industrial operating temperature range of -40 °C to +100 °C.
The Spartan-6 architecture pairs a Virtex-class fabric with cost-optimized 6-input LUTs, dual 18 Kbit block RAM per CLB column, and PCI Express, Gigabit Ethernet, and serial GTP transceivers (selectively enabled on LX devices with the “T” suffix). The 27 mm × 27 mm, 1 mm-pitch FBGA-676 footprint delivers a compact high-density breakout suitable for high-pin-count designs.
Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, broadcast video processing, wired/wireless communication bridges, and high-volume consumer electronics where the LX family’s price-per-logic density is decisive.
When designing with this device, plan power-rail sequencing for the 1.2 V core and the auxiliary VCCAUX/VCCO rails, and use the dedicated configuration pins (M0–M2) to select the boot mode (JTAG, master/slave serial, SPI, or BPI). Provide a JTAG header for in-system programming and boundary-scan debug.
This page synthesizes distributor pricing, drop-in Spartan-6 LX alternatives, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers select and source the right device for high-volume production.
Drop-in alternatives for XC6SLX45-2FGG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX45-2FGG676I (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Block RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX45-2FGG676C
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →XC6SLX45-3FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-N3FG676I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2CSG324I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2FGG484I
✅ Drop-In✓ In Stock
$65.1 / Unit
View Datasheet →XC6SLX45-2FGG676I Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LX |
| Part Number | XC6SLX45-2FGG676I |
| Logic Cells | 43,661 |
| Configurable Logic Blocks (CLBs) | 3,411 |
| Total Flip-Flops | 54,576 |
| Block RAM | 2,088 Kbit |
| DSP48A1 Slices | 58 |
| User I/Os | 358 |
| Number of I/O Banks | 4 |
| Core Voltage | 1.2 V |
| Internal Frequency | 500 MHz |
| Package | 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | -40 °C to +100 °C |
| Speed Grade | -2 |
| Process Technology | 45 nm CMOS |
| Compliance | RoHS compliant, Lead Free |
XC6SLX45-2FGG676I Pin Configuration
| Pin B6 | IO_L1P_HSCLK_AD14P_34 — Bank 34, differential I/O pair (positive) |
| Pin D5 | IO_L1N_HSCLK_AD14N_34 — Bank 34, differential I/O pair (negative) |
| Pin C9 | VCCINT — 1.2 V core supply voltage |
| Pin G7 | VCCAUX — 2.5 V auxiliary supply voltage (typically) |
| Pin H6 | VCCO_14 — Bank 14 I/O supply voltage |
| Pin A2 | CCLK — Configuration clock input |
| Pin D1 | DONE — Configuration DONE indicator (open-drain) |
| Pin E3 | PROG_B — Program/reset (active-low) |
| Pin H4 | M0 — Configuration mode select bit 0 |
| Pin G3 | M1 — Configuration mode select bit 1 |
| Pin F2 | M2 — Configuration mode select bit 2 |
| Pin K7 | TCK — JTAG clock |
| Pin L6 | TDI — JTAG data in |
| Pin M5 | TDO — JTAG data out |
| Pin N4 | TMS — JTAG mode select |
| Pin P3 | GND — Common ground (one of many balls) |
Typical Applications
XC6SLX45-2FGG676I is suitable for 7 applications: Industrial Motor Control & Drives, Machine Vision & Industrial Cameras, Automotive Infotainment & Driver Assistance, Broadcast Video Processing & Display Walls, Wired & Wireless Communication Bridges, High-Volume Consumer Electronics, Software-Defined Radio (SDR) Front-End.
Industrial Motor Control & Drives
The XC6SLX45-2FGG676I is well suited to industrial motor control and servo-drive platforms because of its 58 DSP48A1 slices and 43,661 logic cells, which support up to three-axis field-oriented control (FOC) loops, SVPWM generation, and incremental encoder/Resolver interfaces within a single device. The 358 user I/Os in the FGG676 package allow direct connection to multiple gate drivers, current/voltage sensors, and resolver excitation without external bus muxing, while the integrated memory controller blocks (MCBs) deliver DDR2-backed parameter storage for control tables. The industrial temperature grade of -40 °C to +100 °C matches drive cabinet thermal envelopes.
Recommended
Machine Vision & Industrial Cameras
For machine-vision frame grabbers and industrial camera processing, the XC6SLX45-2FGG676I delivers 58 DSP48A1 slices capable of real-time 2D filtering, Bayer demosaicing, and histogram equalization at gigabit-pix throughputs. The 2,088 Kbit block RAM distributes image-line buffers across the fabric, eliminating external SRAM in compact cameras, and the 4 GTP transceivers in the LX “T” sub-family (when present) or general-purpose LVDS I/O in LX support MIPI-CSI-2, LVDS, and parallel Camera Link inputs. The 676-ball FBGA exposes up to 358 user I/Os for direct MIPI/LVDS lane routing.
Recommended
Automotive Infotainment & Driver Assistance
The XC6SLX45-2FGG676I is used in automotive infotainment and ADAS pre-processing subsystems to drive high-resolution LVDS displays, decode infotainment streams, and preprocess camera or radar data before handing off to higher-tier processors. Its 358 user I/Os enable direct connection to multiple LVDS display panels and surround-view cameras, while the 58 DSP48A1 slices accelerate FFTs used by simple radar preprocessing. Designers should note that this part is industrial-grade -40 °C to +100 °C, so AEC-Q100 applications should select the XA Spartan-6 variant instead.
Recommended
Broadcast Video Processing & Display Walls
Broadcast video routers and large-LED video-wall controllers benefit from the XC6SLX45-2FGG676I’s 58 DSP48A1 slices and rich block RAM, which combine to perform color-space conversion (YUV ↔ RGB), scaling, and frame-rate conversion without external video chips. The 4 GTP serial transceivers on the LX support SDI/HDMI bridging when paired with an external PHY, and the 358 I/Os provide enough parallel bandwidth for 1080p60 raster pipelines. The industrial temperature grade ensures stable operation in studio and equipment-rack thermal environments.
Recommended
Wired & Wireless Communication Bridges
The XC6SLX45-2FGG676I is frequently deployed in protocol-bridging products that translate between industrial buses (EtherCAT, PROFINET, Modbus TCP) and field sensors, using the embedded Gigabit Ethernet MACs and GTP transceivers in the LX family for high-speed serial I/O. Hard or soft-core processors such as the MicroBlaze MCS handle the upper-layer protocol stack, while 58 DSP48A1 slices accelerate cyclic-redundancy, encryption, and timing analysis. The 27 x 27 mm FBGA footprint and 358 I/Os allow multi-port PHY connectivity on a single board.
Recommended
High-Volume Consumer Electronics
In cost-sensitive consumer devices such as home projectors, A/V receivers, set-top boxes, and small-form-factor NAS units, the XC6SLX45-2FGG676I balances the LX family’s price-per-logic with sufficient DSP and I/O to implement custom video scaling, USB-class pipelines, or audio post-processing. The 58 DSP48A1 slices handle real-time audio effects (graphic EQ, spatial rendering), and the 2,088 Kbit block RAM provides embedded frame buffering. The industrial temperature range is more than adequate for indoor consumer thermal envelopes.
Recommended
Software-Defined Radio (SDR) Front-End
Software-defined-radio baseband designs use the XC6SLX45-2FGG676I for digital downconversion, channelization, and digital predistortion, leveraging 58 DSP48A1 slices for parallel FIR filtering and CORDIC-based frequency shifting at IF bandwidths up to about 100 MHz. The 4 dedicated GTP transceivers connect directly to RF ADCs/DACs through LVDS or external SERDES, and the 2,088 Kbit of block RAM supports large reconfigurable FFT windows. The industrial temperature range suits outdoor or vehicle-mounted SDR enclosures.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX45-2FGG676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX45-2FGG676C | XC6SLX45-3FGG676I | XC6SLX45-N3FG676I | XC6SLX45-2CSG324I | XC6SLX45-2FGG484I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FGG676 (676-ball FBGA) | FGG676 (same) | FGG676 (same) | FGG676 (same) | CSG324 (different) | FGG484 (different) |
| Logic Cells | 43,661 | 43,661 | 43,661 | 43,661 | 43,661 | 43,661 |
| User I/Os | 358 | 358 | 358 | 358 | ~215 | ~316 |
| Speed Grade | -2 | -2 | -3 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Commercial (0 °C to +85 °C) | Industrial (-40 °C to +100 °C) | Industrial (-40 °C to +100 °C) | Industrial | Industrial |
| DSP48A1 Slices | 58 | 58 | 58 | 58 | 58 | 58 |
| Block RAM (Kbit) | 2,088 | 2,088 | 2,088 | 2,088 | 2,088 | 2,088 |
Key Differentiators
- 358 I/Os in a single LX-class device (vs Lattice LFE3-70EA-7FN1156I)
- Compact 27 x 27 mm FBGA-676 footprint (vs XC6SLX45-2CSG324I (CSG324))
- Industrial -40 °C to +100 °C temperature grade (vs XC6SLX45-2FGG676C (Commercial))
- Embedded DDR memory controllers (MCBs) (vs XC6SLX45-2FGG484I (FGG484))
Design Notes
The XC6SLX45-2FGG676I requires four power rails: VCCINT (1.2 V ±5%) for the core, VCCAUX (typically 2.5 V) for configuration memory and routing resources, VCCO (1.2/1.5/1.8/2.5/3.3 V depending on bank) for I/O banks, and a dedicated MGTAVCC for GTP transceivers if present. Each VCCO bank must be bypassed with 100 nF X7R ceramic placed within 5 mm of each power pin, and bulk 10 µF decoupling must supply the dynamic transients. Power-on sequencing must follow the AMD/Xilinx recommended sequence; violation may damage the device.
The 27 x 27 mm FGG676 package uses a 1.0 mm ball pitch. PCB stack-ups for this device should use 8 or more layers with microvia-via-in-pad (VIPPO) construction for high-density BGA breakout; standard through-hole vias cannot escape <1.5 mm pitch without dog-bone fanout and beyond 2 layers of signal loss. Use FR4 with controlled dielectric (3.0–3.8 Dk at 1 GHz) and target 50 Ω single-ended characteristic impedance on each layer.
Do NOT connect unused I/O to GND before configuration; Spartan-6 configures I/Os as inputs during config, and external pulldowns can cause latch-up. Use the Xilinx ISE ‘BitGen’ option ‘UnusedPin’ = ‘Pullnone’ and ‘UnconstrainedPins’ = ‘Pullnone’ to keep unused pins high-impedance. Also avoid long floating JTAG chains (TCK/TMS/TDI) on the board: a single bad JTAG connection prevents programming and confuses debug.
For DDR2/DDR3 interfaces, route byte lanes within the same bank with matched lengths (±25 ps) and use 100 Ω differential read-strobe termination. Bank 14 and Bank 15 on the LX45 specifically support the MCB interface; consult UG388 (Memory Interface Solutions) for trace-length matching guidelines. Use IBIS models from AMD to verify signal integrity at 533 Mb/s minimum.
Estimated: with all DSP slices active at 350 MHz and 50% toggle rate, the LX45 dissipates approximately 2.5–3.0 W into a JEDEC EIA/JESD51 four-layer test board (θJA ≈ 13 °C/W). Under standard 4-layer board integration, junction temperature stays well under 100 °C at industrial ambient (85 °C). For sealed enclosures without airflow, consider a thin copper heat-spreader or a small dedicated heatsink to keep Tj below 105 °C long-term.
Compliance Information
Per AMD/Xilinx product listings, the LX family is RoHS/REACH compliant and lead-free; halogen-free status is not explicitly listed in the source data — inferred from AMD policy. This device is NOT AEC-Q100 qualified; choose the XA Spartan-6 variants for automotive-grade applications.
