XC6SLX45-2FGG484I vs XC6SLX45-2FG484I Comparison

Detailed side-by-side comparison of XC6SLX45-2FGG484I by AMD and XC6SLX45-2FG484I by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-2FGG484I XC6SLX45-2FG484I
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Family Spartan-6 LX —
Logic Cells 43,661 43,661 cells
Logic Slices 6,822 —
Flip-Flops 54,576 —
Block RAM 2,138,112 bits (2,088 Kb/s) —
DSP Slices (DSP48A1) 58 —
Maximum User I/O 316 —
Package 484-ball BGA (FBGA-484) 484-BBGA
Package Dimensions 23 x 23 mm, 1.0 mm ball pitch —
Speed Grade -2 -2
Operating Temperature (I grade) -40C to +100C (industrial) —
Process Technology 45 nm low-power CMOS 45 nm CMOS
Supply Voltage Core 1.2 V typical —
Clock Management Tiles 6 CMT (4 DCM + 2 PLL) —
Maximum I/O Speed 800 Mbps LVDS —
Memory Interface Support DDR, DDR2, DDR3, LPDDR —
Configuration Memory AES-256 bitstream encryption [DATA_NEEDED: Configuration memory type and capacity]
RoHS Compliance Lead-free / RoHS compliant —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
Number of I/O — 316 I/O
Listed Internal Frequency — 500 MHz
Core Operating Voltage — 1.2 V
Device Family — Spartan-6 LX
Temperature Grade — Industrial
Operating Temperature Range — -40°C to +100°C (junction temperature)
Mounting Type — Surface mount
Package Pitch — 0.80 mm
Package Lead-Free Status — Lead free
Number of Logic Cells in Alternative Comparison — 43,661 cells
Adaptive Logic Modules — [DATA_NEEDED: Adaptive Logic Module count]
Embedded Memory — [DATA_NEEDED: Embedded block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP slice count]
RoHS Status — [DATA_NEEDED: RoHS compliance status]
REACH Status — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Status — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

Browse All Products Create BOM Request Quote