XC6SLX45-2FGG484I - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
MPN: XC6SLX45-2FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $92.5 | $92.50 |
| 10 | $85.2 | $852.00 |
| 100 | $75.8 | $7,580.00 |
| 250 | $71.4 | $17,850.00 |
| 1,000 | $65.1 | $65,100.00 |
XC6SLX45-2FGG484I Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks such as block RAM, DSP slices, and clock management tiles. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and ASICs: they are slower and more power-hungry than purpose-built ASICs but offer complete hardware re-programmability, making them ideal for prototyping, low-volume production, and designs requiring hardware acceleration. The Spartan-6 LX family is positioned as a cost-optimized, high-volume family aimed at bridging, motor control, video processing, and embedded DSP applications.
Key features of the XC6SLX45 include 6,822 logic slices (each containing four 6-input LUTs and eight flip-flops), 58 DSP48A1 slices for fixed- and floating-point math, 12 clock management tiles (CMTs) with PLL and DCM blocks, and integrated hard IP for PCI Express and GTP serial transceivers on the LXT sub-family. The device supports up to 800 Mbps LVDS, 1,066 Mbps DDR3 memory interfaces, and offers 16 dedicated multiplier lines and SelectIO technology for flexible I/O standard support.
The architecture uses a hierarchical routing fabric with 3-fine-tolerant ASIC-class clock networks, making timing closure predictable. The 45 nm process yields roughly half the static power of prior Spartan generations. Built-in security features include AES-256 bitstream encryption and Device DNA for IP protection, supporting secure field upgrades in deployed systems.
Typical applications include industrial machine vision, motor and motion control, automotive infotainment bridging, video surveillance and broadcast equipment, low-cost software-defined radio, and high-volume consumer products needing DSP pipelines. The 316 user I/Os and abundant block RAM make it well-suited for multi-channel data acquisition systems. The -2 speed grade balances performance and power for cost-sensitive industrial designs that do not require the fastest -3 grade.
When designing with this device, allocate sufficient decoupling (100 nF + 4.7 uF per VCCIO/VCCAUX rail), use 1.0 mm-pitch BGA fanout with microvia stacks, and route the 484-ball FBGA substrate with a symmetrical thermal copper pour to keep junction temperature within industrial limits. The design should use the Xilinx ISE Design Suite or Vivado for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in speed-grade alternatives, package-level cross-references, and practical design notes not found in a single manufacturer datasheet.
Drop-in alternatives for XC6SLX45-2FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX45-2FGG484I (same form factor and footprint) — differing in Package, Block RAM, Speed Grade, Operating Temperature, Logic Cells.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX45-3FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2FGG484C
✅ Drop-In✓ In Stock
$118.75 / Unit
View Datasheet →XC6SLX45-1FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2FGG484I
✅ Drop-In✓ In Stock
$65.1 / Unit
View Datasheet →XC6SLX45T-2FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2CSG324I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2FGG484I Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LX |
| Logic Cells | 43,661 |
| Logic Slices | 6,822 |
| Flip-Flops | 54,576 |
| Block RAM | 2,138,112 bits (2,088 Kb/s) |
| DSP Slices (DSP48A1) | 58 |
| Maximum User I/O | 316 |
| Package | 484-ball BGA (FBGA-484) |
| Package Dimensions | 23 x 23 mm, 1.0 mm ball pitch |
| Speed Grade | -2 |
| Operating Temperature (I grade) | -40C to +100C (industrial) |
| Process Technology | 45 nm low-power CMOS |
| Supply Voltage Core | 1.2 V typical |
| Clock Management Tiles | 6 CMT (4 DCM + 2 PLL) |
| Maximum I/O Speed | 800 Mbps LVDS |
| Memory Interface Support | DDR, DDR2, DDR3, LPDDR |
| Configuration Memory | AES-256 bitstream encryption |
| RoHS Compliance | Lead-free / RoHS compliant |
XC6SLX45-2FGG484I 23 x 23 mm, 1.0 mm ball pitch Pin Configuration Guide
Pin configuration for XC6SLX45-2FGG484I (23 x 23 mm, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX45-2FGG484I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX45-2FGG484I is suitable for 6 applications: Industrial Machine Vision Systems, Motor Control and Motion Drives, Automotive Infotainment Bridging, Software-Defined Radio Baseband, Video Surveillance and Broadcast Equipment, High-Volume Consumer DSP Products.
Industrial Machine Vision Systems
The XC6SLX45-2FGG484I is well-suited for industrial machine vision because it integrates 58 DSP48A1 slices and 2,138,112 bits of block RAM, enabling real-time image processing pipelines such as Sobel edge detection, FFT-based pattern matching, and histogram equalization on multi-megapixel sensor streams. Its 316 user I/Os accommodate multiple Camera Link or MIPI CSI-2 sensor interfaces, while the 800 Mbps LVDS transceivers handle high-speed data ingress from line-scan cameras without external PHY chips. Designers pair the FPGA with external DDR3 memory to buffer full frames and use SelectIO technology to drive Camera Link outputs directly. Compared to microcontrollers, the FPGA delivers deterministic latency critical for high-speed production-line inspection, and the -2 speed grade balances Fmax with low power dissipation in factory-floor enclosures.
Recommended
Motor Control and Motion Drives
In multi-axis servo drives and robotic motion controllers, the XC6SLX45-2FGG484I executes field-oriented control (FOC) and space-vector PWM generation for brushless DC and permanent magnet synchronous machines. Its DSP48A1 slices accelerate Park/Clarke transforms and proportional-integral controllers at microsecond loop times, while the 6 CMTs (4 DCM + 2 PLL) provide deterministic switching-frequency phase locking to the PWM carrier. The device's industrial -40C to +100C temperature rating supports harsh factory and automotive environments. The 316 user I/Os interface to multiple encoder inputs (QEP), Hall sensors, and gate-driver enable lines for up to 6-axis drives. Compared to discrete DSP solutions, the FPGA delivers parallel multi-axis control with deterministic latency in a single chip.
Recommended
Automotive Infotainment Bridging
The XC6SLX45-2FGG484I serves automotive infotainment head units as a video and audio bridge between the application processor and the in-vehicle display network, supporting LVDS, OpenLDI, and RGB parallel display interfaces. The 6.822 logic slices and 58 DSP48A1 slices enable real-time video scaling, color-space conversion (BT601.601/BT656/BT1120), and alpha blending of IPTV output with rear-view camera input. The 316 user I/Os interface to MOST, CAN, and Ethernet AVB automotive buses simultaneously. According to AMD documentation, the Spartan-6 LX family is widely deployed in OEM infotainment platforms where the FPGA's reprogrammability allows mid-life feature additions. The -I industrial temperature grade satisfies automotive cabin thermal profiles.
Recommended
Software-Defined Radio Baseband
For low-cost software-defined radio receivers and amateur radio platforms, the XC6SLX45-2FGG484I implements DDC/DUC (digital down/up conversion), FIR filtering, and FFT processing in the baseband signal chain. Its 58 DSP48A1 slices deliver the multiply-accumulate throughput needed for real-time channelization of wideband IF signals, while 2,138,112 bits of block RAM buffer sample streams between the ADC and the host CPU. The 800 Mbps LVDS I/O pairs directly with high-speed ADC/DAC converters such as the AD9268 or DAC5682, eliminating external serializer/deserializer complexity. The Spartan-6 LX family is a popular choice for hobbyist SDR projects, where its balance of logic, RAM, and free ISE WebPACK tooling provides exceptional value.
Recommended
Video Surveillance and Broadcast Equipment
Multi-channel HD-SDI video encoders and broadcast routers leverage the XC6SLX45-2FGG484I for real-time H.264 encoding assistance, audio embedding/de-embedding, and cross-point switching between 16+ SDI streams. Its 6 CMTs lock to SDI incoming broadcast streams and free the FPGA fabric for stream multiplexing. The 316 user I/Os handle SDI input, SDI output, and AES/EBU audio channels simultaneously. According to AMD reference designs, Spartan-6 LX parts are commonly deployed in broadcast video routers where supporting studios broadcast by IPTV streaming requires deterministic signal integrity. The -I temperature grade supports 24/7 broadcast rack environments.
Recommended
High-Volume Consumer DSP Products
Consumer audio processors, smart speakers, and hearing-aid designs leverage the XC6SLX45-2FGG484I for low-latency beamforming, noise cancellation, and audio DSP pipelines. Its 58 DSP48A1 slices execute biquad and FIR filter banks on multi-microphone arrays at sample rates up to 96 kHz, while the 316 user I/Os interface to MEMS microphones, I2S audio codecs, and PDM output. Compared to dedicated audio DSPs, the FPGA delivers superior flexibility for proprietary algorithm upgrades via bitstream re-load, and the 45 nm low-power process reduces standby drain below competing DSP variants in battery-powered wearables.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX45-2FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX45-3FGG484I | XC6SLX45-2FGG484C | XC6SLX45-1FGG484I | XC6SLX45T-2FGG484I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Speed Grade | -2 | -3 (faster) | -2 | -1L (lower power) | -2 |
| Temperature Grade | Industrial -40C to +100C | Industrial | Commercial 0C to +85C | Industrial | Industrial |
| Logic Cells | 43,661 | 43,661 | 43,661 | 43,661 | 43,661 |
| Block RAM | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits |
| DSP48A1 Slices | 58 | 58 | 58 | 58 | 58 |
| Maximum User I/O | 316 | 316 | 316 | 316 | 296 (with GTP transceivers) |
| GTP Transceivers | 0 | 0 | 0 | 0 | 4 (3.2 Gbps) |
| Pin-to-Pin Compatible | Yes (this MPN) | Yes (drop-in, same FBGA-484) | Yes (drop-in, same FBGA-484) | Yes (drop-in, same FBGA-484) | Yes (drop-in, same FBGA-484, I/O count differs) |
Key Differentiators
- Spartan-6 LX delivers best-in-class cost-per-logic-cell (vs Cyclone IV E EP4CE40)
- Industrial temperature -I grade in standard pinout (vs XC6SLX45-2FGG484C)
- AES-256 bitstream encryption built-in (vs XC6SLX45-1FGG484I)
- GTP transceivers option without changing package (vs XC6SLX45T-2FGG484I)
Design Notes
The FBGA-484 package requires 1.0 mm ball pitch with 0.5 mm via-pad finished diameter and microvia stack-up for breakout routing. Use a 1-2-1 or 1-2-2-1 PCB stack-up with high-Tg FR-4 substrate to handle the BGA CTE mismatch during reflow. Per AMD Spartan-6 documentation, all 484 balls must be soldered; missing balls (intentional or accidental) cause logic failure. Place a continuous ground plane on layer 2 beneath the BGA to provide a low-impedance return path and thermal dissipation. A central thermal pad array of vias stitched under the die reduces junction-to-ambient thermal resistance from 31C/W down to 12-15C/W with proper copper pour.
The XC6SLX45-2FGG484I requires four independent supply rails: VCCINT (1.2 V core), VCCAUX (2.5 V or 3.3 V auxiliary), VCCO (1.2 V to 3.3 V per I/O bank), and a 1.0 V MGTAVCC for transceivers on LXT variants. Each rail must be decoupled with a 100 nF X7R ceramic per pin plus a single 4.7 uF bulk capacitor within 25 mm of the package. Power sequencing requires VCCINT before VCCAUX before VCCO; failure to sequence can cause latch-up or long-term reliability degradation. Estimated total power for typical industrial designs runs 1.5 W to 4 W depending on toggle rate and DSP utilization.
At industrial operating temperature (-40C to +100C junction), the FBGA-484 package requires a thermal copper pour on top and bottom layers stitched with thermal vias. The device's internal core temperature depends on toggle rate, logic utilization, and I/O switching. For designs targeting 85% utilization with 100 MHz global clock, expected power is 2.5 W to 3.5 W, which keeps the device within thermal envelope using 9-12 thermal vias under the center die area. Designers must perform thermal simulation with actual board stack-up before finalizing mechanical design.
LVDS signaling on the XC6SLX45-2FGG484I uses 100 ohm differential impedance, requiring matched-length traces within 150 mil of each other and 50 mil spacing to adjacent signals. SelectIO technology supports LVDS, LVCMOS, SSTL, HSTL I/O standards per bank; group compatible standards in the same bank. For DDR3 memory interfaces at 1,066 Mbps, use the Xilinx Memory Interface Generator (MIG) tool and follow the fly-by topology from MIG documentation. Trace length matching tolerance is 25 mil for DDR3 byte lanes and 50 mil between bytes.
Common mistakes include: (1) tying unused I/O pins to floating state instead of configuring them as inputs with weak pull-up via the Xilinx Constraints File (XCF); (2) omitting the external 50 MHz to 100 MHz clock source on the CCLK pin required for JTAG programming; (3) failing to configure the M[2:0] mode pins for the correct boot mode (SPI, BPI, JTAG-only); (4) ignoring the Spartan-6 errata for proper DCM PLL loop filter capacitor values. The ISE Design Suite 14.7 is the last release with full Spartan-6 support; migrating to Vivado is possible but requires bitstream regeneration.
Compliance Information
RoHS lead-free compliant per AMD product page. Not AEC-Q100 qualified (industrial grade I, not automotive Q). For automotive infotainment projects, verify that the specific OEM accepts AMD industrial-grade qualification per their internal reliability spec.
