XC6SLX45-2FGG676I vs XC6SLX45-2FG676I Comparison

Detailed side-by-side comparison of XC6SLX45-2FGG676I by AMD and XC6SLX45-2FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-2FGG676I XC6SLX45-2FG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Spartan-6 LX —
Part Number XC6SLX45-2FGG676I —
Logic Cells 43,661 43,661 cells
Configurable Logic Blocks (CLBs) 3,411 —
Total Flip-Flops 54,576 —
Block RAM 2,088 Kbit [DATA_NEEDED: block RAM capacity]
DSP48A1 Slices 58 —
User I/Os 358 —
Number of I/O Banks 4 —
Core Voltage 1.2 V —
Internal Frequency 500 MHz —
Package 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch 676-BGA
Operating Temperature (Industrial) -40 °C to +100 °C —
Speed Grade -2 -2
Process Technology 45 nm CMOS —
Compliance RoHS compliant, Lead Free —
Device Type — Spartan-6 LX Field Programmable Gate Array (FPGA)
I/O Count — 358 I/O
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Temperature Grade — Industrial
Package Type — BGA
Number of Terminals — 676
Package Shape — Square
Terminal Form — Ball
Programmable Logic Type — FPGA
Manufacturer — AMD / Xilinx
RoHS Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Maximum Clock Frequency — [DATA_NEEDED: maximum clock frequency]
DSP Resources — [DATA_NEEDED: DSP resource count]

Datasheets & Resources

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