XC6SLX45-3FG484C vs XC6SLX45-2FG484I Comparison

Detailed side-by-side comparison of XC6SLX45-3FG484C by AMD and XC6SLX45-2FG484I by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX45-3FG484C XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484C ✓ Active

Specification Comparison

Parameter XC6SLX45-3FG484C XC6SLX45-2FG484I
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type Spartan-6 LX Field Programmable Gate Array (FPGA) Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Cells 43,661 cells 43,661 cells
Adaptive Logic Modules 6,822 ALM [DATA_NEEDED: Adaptive Logic Module count]
Embedded Memory 2.04 Mbit [DATA_NEEDED: Embedded block RAM capacity]
User I/O 316 I/O —
Internal Frequency 500 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V —
Speed Grade -3 -2
Temperature Grade Commercial Industrial
Operating Temperature 0 °C to 85 °C —
Package 484-BBGA 484-BBGA
Package Dimensions 15 mm × 15 mm —
Package Ball Pitch 0.80 mm —
Catalog Package Detail MO-275, CSBGA-324 —
Catalog Pin Count 324 pins —
Mounting Type Surface Mount Surface mount
Lead-Free Packaging Lead free —
REACH Status REACH unaffected [DATA_NEEDED: REACH compliance status]
Number of I/O — 316 I/O
Listed Internal Frequency — 500 MHz
Core Operating Voltage — 1.2 V
Device Family — Spartan-6 LX
Operating Temperature Range — -40°C to +100°C (junction temperature)
Package Pitch — 0.80 mm
Package Lead-Free Status — Lead free
Number of Logic Cells in Alternative Comparison — 43,661 cells
DSP Resources — [DATA_NEEDED: DSP slice count]
Configuration Memory — [DATA_NEEDED: Configuration memory type and capacity]
RoHS Status — [DATA_NEEDED: RoHS compliance status]
AEC-Q100 Status — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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