XC6SLX45-3FGG676C vs XC6SLX45-2FGG676C Comparison

Detailed side-by-side comparison of XC6SLX45-3FGG676C by Xilinx and XC6SLX45-2FGG676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-3FGG676C XC6SLX45-2FGG676C
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array —
Logic Cells 43,661 cells 43,661
Process Technology 45 nm CMOS 45 nm CMOS, low-power copper
Core Supply Voltage 1.2 V —
Internal Frequency 500 MHz —
Package 676-ball BGA 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch
Package Outline MO-275 —
Package Dimensions 15 mm x 15 mm —
Package Pitch 0.80 mm —
Surface Mounting Surface Mount —
Operating Temperature 0°C to 85°C 0 C to +85 C (commercial, "C" suffix)
Speed Grade -3 -2 (standard performance)
Logic Block Count [DATA_NEEDED: logic block count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
Distributed RAM Capacity [DATA_NEEDED: distributed RAM capacity] —
Digital Transceivers [DATA_NEEDED: digital transceiver count] —
Maximum I/O [DATA_NEEDED: maximum I/O count] —
Lead-Free Status Lead Free —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Pin/Ball Assignment [DATA_NEEDED: complete pin and ball assignment] —
Device Family — Spartan-6 LX
Block RAM (bits) — 2,138,112
User I/O Count — 358
Number of CLBs — 3,411
Core Voltage (Vccint) — 1.2 V nominal (1.14 V to 1.26 V range)
Auxiliary Voltage (Vccaux) — 2.5 V nominal
I/O Bank Voltage (Vcco) — 1.2 V to 3.3 V per bank
Mounting Type — Surface Mount (BGA)
MSL Level — 3 (168 hours)
Lead Free / REACH — Lead free per MO-275

Datasheets & Resources

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