XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD
MPN: XC6SLX45-2FGG676C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.18 | $32.18 |
| 10 | $30.57 | $305.70 |
| 100 | $28.96 | $2,896.00 |
| 500 | $26.35 | $13,175.00 |
| 1,000 | $24.5 | $24,500.00 |
XC6SLX45-2FGG676C Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can re-program after manufacture to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (highest efficiency, no flexibility) and microcontrollers (software-defined, lower throughput). In the broader taxonomy, the Spartan-6 LX sits inside the FPGA & CPLD category, alongside Lattice ECP-series, Intel Cyclone series, and AMD/Xilinx Artix-7 and Spartan-7 successor families.
Key features include 4 DSP48A1 slices, 6 PLLs, 4 Memory Controller Blocks (MCBs), and PCI Express endpoint capability on selected Spartan-6 LXT variants. The device supports up to 500 MHz internal clock speeds and consumes roughly half the power of previous-generation Spartan FPGAs. Integrated SelectIO technology provides flexible I/O voltage support across 1.2V to 3.3V standards, including LVCMOS, LVTTL, SSTL, and differential pairs.
Architecturally, the Spartan-6 LX uses a Configurable Logic Block (CLB) array with 4 LUTs per slice, dedicated carry chains, and distributed SRL32 shift-register capability. Hardened IP blocks (PCIe, GTP transceivers on LXT, MCBs, block RAM, DSP48A1 slices) are arranged in column form along the device fabric, delivering predictable performance for memory and DSP pipelines. The configuration bitstream is loaded via JTAG, Serial (SPI/BPI) modes, or internal flash on supported densities.
Typical applications include industrial motor control, video processing pipelines, low-cost PCIe endpoint cards (on LXT variants), embedded vision, and legacy parallel bus bridging. The 358 I/Os make it well suited for connecting to DDR2/DDR3 memory, parallel ADC/DAC interfaces, and high-pin-count display or camera links. Industrial-grade and commercial temperature screening is available across the family.
When designing with this device, ensure the supply rails (Vccint 1.2V core, Vccaux 2.5V, Vcco 1.2-3.3V per bank) are sequenced per AMD guidelines and that decoupling capacitance matches the UG385 reference design. The 1.0 mm pitch FBGA requires PCB fabrication capable of microvia stack-ups; design rule checks should validate escape routing for inner-row balls.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for XC6SLX45-2FGG676C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX45-2FGG676C (same form factor and footprint) — differing in Package, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX45-2FGG676I
✅ Drop-In✓ In Stock
$55.8 / Unit
View Datasheet →XC6SLX75-2FGG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-3FGG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-N3FG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX45-2FGG676C
✅ Drop-In✓ In Stock
$24.5 / Unit
View Datasheet →XC6SLX45-2FGG676C Maximum Ratings & Electrical Characteristics
| Device Family | Spartan-6 LX |
| Logic Cells | 43,661 |
| Block RAM (bits) | 2,138,112 |
| User I/O Count | 358 |
| Number of CLBs | 3,411 |
| Package | 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch |
| Speed Grade | -2 (standard performance) |
| Process Technology | 45 nm CMOS, low-power copper |
| Core Voltage (Vccint) | 1.2 V nominal (1.14 V to 1.26 V range) |
| Auxiliary Voltage (Vccaux) | 2.5 V nominal |
| I/O Bank Voltage (Vcco) | 1.2 V to 3.3 V per bank |
| Operating Temperature | 0 C to +85 C (commercial, "C" suffix) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| Lead Free / REACH | Lead free per MO-275 |
XC6SLX45-2FGG676C 676-ball ffg / fbga, 27 x 27 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for XC6SLX45-2FGG676C (676-ball ffg / fbga, 27 x 27 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX45-2FGG676C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX45-2FGG676C is suitable for 6 applications: Industrial Motor Control and Drive, Video Processing Pipeline and Display, PCI Express Endpoint Card (LXT Sub-Family), Embedded Vision and Machine Vision, Legacy Parallel Bus Interfacing and Bridging, Aerospace and Defense Avionics (Industrial Variant).
Industrial Motor Control and Drive
The XC6SLX45-2FGG676C's 43,661 logic cells and 58 DSP48A1 slices deliver real-time control loop computation for industrial motor drives including field-oriented control (FOC), sinusoidal PWM, and quadrature encoder decoding. The 358 user I/Os support simultaneous interface to power-stage gate signals, current/voltage ADCs, encoder feedback, and EtherCAT or CAN-FD communication. At 500 MHz internal fabric, the LX45 meets the 16 kHz to 32 kHz PWM switching rates typical of servo drives while leaving room for safety logic and diagnostic firmware. The -40C to +85C variant enables outdoor cabinet and factory-floor deployment.
Recommended
Video Processing Pipeline and Display
With 358 I/Os and dedicated memory controller blocks, the XC6SLX45-2FGG676C bridges parallel camera sensors, performs real-time image processing such as color space conversion and edge detection, and drives LVDS or RGB display panels. The 2,138,112 bits of block RAM provide approximately 261 Kbits of dual-port frame-line buffer, sufficient for progressive scan line buffers and histogram accumulators. The SelectIO technology supports LVDS-25, LVCMOS-18, and LVCMOS-33 simultaneously across banks, enabling direct connection to modern CMOS image sensors and legacy display interfaces without external level shifters.
Recommended
PCI Express Endpoint Card (LXT Sub-Family)
Although the LX45 variant lacks the integrated GTP transceivers of the LXT family, the LX45 still functions as a PCIe endpoint bridge when paired with external serializer/deserializer chips, supporting PCIe Gen1 x1/x2 endpoint applications such as low-cost data acquisition cards. The integrated PCIe hard IP core in Spartan-6 supports endpoint configuration, MSI/MSI-X interrupts, and up to 8 KB payload transfers. With 358 I/Os, the LX45 also handles local bus glue logic, GPIO expansion, and legacy ISA-style interfacing to host processors.
Recommended
Embedded Vision and Machine Vision
The XC6SLX45-2FGG676C executes CNN inference, image preprocessing, and feature extraction pipelines in cost-sensitive machine vision systems. With 58 DSP48A1 slices delivering up to 100 GMAC/s at 250 MHz, the LX45 accelerates convolutional kernels, Sobel edge detection, and optical flow algorithms at frame rates from 30 fps to 60 fps for VGA-resolution inputs. The high I/O count supports direct MIPI-CSI-Soft-2 interface to image sensors via FPGA fabric-based deserialization, eliminating the need for external bridge chips. Block RAM provides intermediate frame storage for temporal noise reduction pipelines.
Recommended
Legacy Parallel Bus Interfacing and Bridging
The 358 I/Os of the XC6SLX45-2FGG676C make it ideal for bridging legacy parallel buses (ISA, VME, PC/104) to modern serial interfaces in industrial retrofit applications. The device supports up to 16-bit wide memory interfaces through the dedicated MCBs (Memory Controller Blocks), enabling direct connection to legacy SRAM, NOR flash, and DDR/DDR2 memory devices used in long-lifecycle industrial systems. Designers typically implement bus protocol translation (e.g., parallel ADC to SPI or parallel GPIO to USB) in firmware, replacing obsolete glue logic ASICs.
Recommended
Aerospace and Defense Avionics (Industrial Variant)
The XC6SLX45-2FGG676C industrial-temperature variant supports avionics subsystems such as flight data acquisition, MIL-STD-1553 monitoring (via external transceiver), and ARINC 429 bus bridging for legacy aircraft systems. The 45 nm low-power process and AMD's aerospace flow control make the LX45 attractive for SWaP-C-constrained avionics bays. Designers pair the LX45 with radiation-tolerant companion devices when single-event effects are a concern, using the FPGA for deterministic low-latency bus bridging while reserving housekeeping and parameter storage for rad-hard MCUs.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX45-2FGG676C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX45-2FGG676I | XC6SLX75-2FGG676C | XC6SLX45-3FGG676C | XC6SLX45-N3FG676C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FBGA (FGG676) | 676-ball FBGA (FGG676) | 676-ball FBGA (FGG676) | 676-ball FBGA (FGG676) | 676-ball FBGA (FG676) |
| Logic Cells | 43,661 | 43,661 | 74,637 | 43,661 | 43,661 |
| Speed Grade | -2 (standard) | -2 (standard) | -2 (standard) | -3 (fast) | -N3 (low power) |
| Operating Temperature | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| User I/Os | 358 | 358 | 358 | 358 | 358 |
| Block RAM (bits) | 2,138,112 | 2,138,112 | 3,095,040 | 2,138,112 | 2,138,112 |
| DSP48A1 Slices | 58 | 58 | 132 | 58 | 58 |
| Process / Core Voltage | 45 nm / 1.2 V Vccint | 45 nm / 1.2 V Vccint | 45 nm / 1.2 V Vccint | 45 nm / 1.2 V Vccint | 45 nm / 1.2 V Vccint |
Key Differentiators
- High I/O density within Spartan-6 LX family (vs XC6SLX25-2FT256I)
- Drop-in scalability to LX75 (vs XC6SLX75-2FGG676C)
- Industrial temperature variant on identical die (vs XC6SLX45-2FGG676I)
- Speed grade flexibility (-2 / -3 / -N3) (vs XC6SLX45-N3FG676C)
Design Notes
The XC6SLX45-2FGG676C requires Vccint 1.2V (core), Vccaux 2.5V, and Vcco 1.2-3.3V per I/O bank. Per the AMD Spartan-6 power management guide (UG30189), sequencing order matters: Vccint must reach its threshold before Vccaux, and Vccaux before Vcco. Use a dedicated power management IC such as the TPS54560QDDAQ1 for the 1.2V core rail with at least 20% headroom for inrush. Estimate: a fully utilized LX45 at -2 speed grade draws roughly 1-2A dynamic current plus quiescent - place input bulk capacitance of 220 uF minimum close to the device.
The 676-ball FBGA at 1.0 mm pitch requires PCB fabrication capable of laser-drilled microvias. Route inner balls through staggered microvia stack-ups from the top signal layer to inner layers 3-6. Maintain at least 1.0 mm drill-to-copper clearance for via-in-pad designs, and verify with the fabricator that stacked microvia reliability exceeds 100 thermal cycles. Keep ground stitching vias every 2.5 mm or less around the BGA perimeter to provide a low-impedance return path for high-speed SelectIO signals.
Estimate: at maximum utilization with 58 DSP slices active at 250 MHz, the LX45 dissipates roughly 3-4W. With a 27 x 27 mm package and 676 balls providing thermal conduction, theta-JA is approximately 15-20 C/W on a standard 6-layer PCB with 102 copper coverage. Designers should provide a thermal copper pour beneath the BGA and consider a small heatsink if junction temperature exceeds 85 C ambient. Junction temperature must stay below 125 C for the commercial temperature grade.
The XC6SLX45-2FGG676C configuration bitstream loads via JTAG, Slave Parallel (SelectMAP), Master SPI, or Master BPI. For production boards, use a dedicated configuration flash (e.g., 128 Mbit SPI flash) routed to the FPGA's dedicated SPI pins to enable fast field updates. The bitstream size for LX45 with all features is approximately 16-22 Mbits uncompressed; enable bitstream compression in ISE/Vitis to reduce flash footprint by 30-50%.
Do not leave SelectIO bank voltages floating - each Vcco rail must reach its final value within the AMD-specified 100 ms power-on window or the device may enter configuration with corrupted I/O state. Do not connect unused MGT/GTP pins on LX45 variants - they are no-connects internally. Avoid routing high-speed differential pairs across the BGA center where return path discontinuity is worst. Finally, validate that the Spartan-6 device supports your required I/O standard at the target data rate (LVDS-25 supports up to 1 Gbps; LVCMOS-33 tops out around 200 MHz).
Compliance Information
Lead free per MO-275 JEDEC standard. RoHS and REACH compliance per AMD product page. Spartan-6 family is not AEC-Q100 qualified - select industrial variants for -40C to +100C ranges.
