XC6SLX45-3FGG676C vs XC6SLX45-2FGG676I Comparison

Detailed side-by-side comparison of XC6SLX45-3FGG676C by Xilinx and XC6SLX45-2FGG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-3FGG676C XC6SLX45-2FGG676I
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array —
Logic Cells 43,661 cells 43,661
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V —
Internal Frequency 500 MHz 500 MHz
Package 676-ball BGA 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch
Package Outline MO-275 —
Package Dimensions 15 mm x 15 mm —
Package Pitch 0.80 mm —
Surface Mounting Surface Mount —
Operating Temperature 0°C to 85°C —
Speed Grade -3 -2
Logic Block Count [DATA_NEEDED: logic block count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
Distributed RAM Capacity [DATA_NEEDED: distributed RAM capacity] —
Digital Transceivers [DATA_NEEDED: digital transceiver count] —
Maximum I/O [DATA_NEEDED: maximum I/O count] —
Lead-Free Status Lead Free —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Pin/Ball Assignment [DATA_NEEDED: complete pin and ball assignment] —
Family — Spartan-6 LX
Part Number — XC6SLX45-2FGG676I
Configurable Logic Blocks (CLBs) — 3,411
Total Flip-Flops — 54,576
Block RAM — 2,088 Kbit
DSP48A1 Slices — 58
User I/Os — 358
Number of I/O Banks — 4
Core Voltage — 1.2 V
Operating Temperature (Industrial) — -40 °C to +100 °C
Compliance — RoHS compliant, Lead Free

Datasheets & Resources

Browse All Products Create BOM Request Quote