XC6SLX45-N3FG484C vs XC6SLX45-2FG484C Comparison
Detailed side-by-side comparison of XC6SLX45-N3FG484C by AMD and XC6SLX45-2FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX45-N3FG484C | XC6SLX45-2FG484C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Manufacturer | AMD | — |
| Device Family | Spartan-6 LX | — |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 cells | — |
| User I/O Count | 316 I/O | — |
| Package | 484-BBGA | 484-pin FBGA, 15 x 15 mm, 0.80 mm pitch |
| Mounting Type | Surface Mount | — |
| Programmable Logic Type | FPGA | — |
| Technology Node | [DATA_NEEDED: technology node] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | 1.2 V |
| I/O Supply Voltage Range | [DATA_NEEDED: I/O supply voltage range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 43,661 LE |
| Adaptive Logic Modules | — | 6,822 ALM |
| Embedded Memory | — | 2.04 Mbit |
| Internal Frequency | — | 500 MHz |
| I/O Sites | — | 316 I/O |
| Package Pins | — | 484 pins |
| Process Technology | — | 45 nm CMOS |
| Operating Temperature | — | 0°C to 85°C |
| Speed Grade | — | -2 |
| Temperature Grade | — | Commercial (C) |
| Logic Architecture | — | Adaptive Logic Module (ALM) FPGA |
| Programming Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Maximum Clock Frequency | — | [DATA_NEEDED: maximum user clock frequency] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Lead-Free Termination | — | Lead-free package |
| Package Dimensions | — | 15 x 15 mm |
| Ball Pitch | — | 0.80 mm |