XC6SLX45-2FG484C - 45K Logic Cell Spartan-6 FPGA | AMD
MPN: XC6SLX45-2FG484C ✓ ActiveXC6SLX45-2FG484C Overview
A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. In the product hierarchy, an FPGA is a programmable-logic device, an adaptive computing component, and a semiconductor. It offers more flexibility than a fixed-function application-specific integrated circuit while providing deterministic parallel hardware for control, signal processing, interface bridging, and data acquisition.
The XC6SLX45-2FG484C provides 43,661 logic elements organized into 6,822 adaptive logic modules, together with 2.04 Mbit of embedded block RAM. Its listed internal frequency is 500 MHz. These resources support parallel datapaths, state machines, protocol interfaces, and control logic without relying on a CPU for every real-time operation. The device also provides 316 available I/O sites according to the distributor data.
The -2 suffix identifies the Spartan-6 performance grade, while -3 devices provide a higher performance grade and -1L provides a lower-power-oriented option within the same family. The target operates from a listed 1.2 V supply. Its 45 nm CMOS construction and embedded-memory architecture allow multiple independent processing blocks to run concurrently, making deterministic throughput preferable to sequential software execution for time-critical control paths.
Typical uses include industrial automation, industrial networking, embedded control, instrumentation, consumer bridging, and automotive infotainment. The 316 I/O sites provide substantial connectivity for external memory, control signals, communications transceivers, and mixed-signal interfaces. The commercial 0°C to 85°C range is appropriate for indoor commercial and industrial equipment, while extended-temperature or automotive requirements should be checked against the exact selected ordering code.
Designers should verify the precise 484-ball footprint, pin assignments, exposed-pad connection, supported I/O standards, and memory interface compatibility in the AMD/Xilinx package data. The target designation in the verified results is also inconsistent, with some distributors listing FGG484C while the requested MPN and comparison sources use FG484C; the physical ball map and bill of materials should therefore be confirmed against the manufacturer documentation before layout release or procurement.
This page combines verified source specifications, commercial availability information, package details, comparison data, and practical replacement guidance. It also distinguishes confirmed same-package drop-in options from cross-reference leads that require additional package and temperature verification, helping engineers make a more reliable sourcing and design decision.
Drop-in alternatives for XC6SLX45-2FG484C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX45-2FG484C (same form factor and footprint) — differing in Device Type, Speed Grade, Temperature Grade, Operating Temperature, Package.
XC6SLX45-2FG484I
✅ Drop-InContact for price
View Datasheet →XC6SLX45-3FG484I
✅ Drop-InContact for price
View Datasheet →XC6SLX45-2FG484C Maximum Ratings & Electrical Characteristics
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Elements | 43,661 LE |
| Adaptive Logic Modules | 6,822 ALM |
| Embedded Memory | 2.04 Mbit |
| Internal Frequency | 500 MHz |
| I/O Sites | 316 I/O |
| Package Pins | 484 pins |
| Package | 484-pin FBGA, 15 x 15 mm, 0.80 mm pitch |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Operating Temperature | 0°C to 85°C |
| Speed Grade | -2 |
| Temperature Grade | Commercial (C) |
| Logic Architecture | Adaptive Logic Module (ALM) FPGA |
| Lead-Free Termination | Lead-free package |
| Package Dimensions | 15 x 15 mm |
| Ball Pitch | 0.80 mm |
XC6SLX45-2FG484C 15 x 15 mm Pin Configuration Guide
Pin configuration for XC6SLX45-2FG484C (15 x 15 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX45-2FG484C.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX45-2FG484C is suitable for 6 applications: Industrial Automation and Programmable Control, Industrial Networking and Protocol Bridging, Data Acquisition and Instrumentation, High-Speed Embedded Storage and Data Control, Consumer and Automotive Infotainment Bridging, High-Rate Communication Interface Consolidation.
Industrial Automation and Programmable Control
XC6SLX45-2FG484C fits industrial automation when a controller must execute multiple control tasks deterministically rather than relying only on sequential software. Its 43,661 logic elements and 6,822 adaptive logic modules can implement motion sequencing, interlocks, status decoding, and machine-control logic in parallel. The 2.04 Mbit embedded memory provides useful capacity for FIFO structures and local state, while 316 I/O sites simplify connection to sensors, actuators, encoders, and industrial interfaces. For equipment rated for indoor commercial and industrial environments, the specified 0°C to 85°C operating range is appropriate. Final qualification still requires confirmation of the exact C suffix, supported I/O standards, timing closure at the -2 speed grade, and the package’s power and ground-ball requirements.
Recommended
Industrial Networking and Protocol Bridging
XC6SLX45-2FG484C can serve as a configurable protocol-conversion and network-bridging engine when several serial interfaces and timing domains must be coordinated. The Spartan-6 LX architecture provides 43,661 logic elements for parallel packet processing, 2.04 Mbit of embedded block RAM for buffering, and 316 I/O sites for connecting digital transceivers. A -2-grade design can place framing, filtering, checksum, and flow-control logic beside the relevant I/O banks. This architecture can bridge industrial protocols without a CPU handling every packet. Engineers must still verify each transceiver’s voltage, signaling standard, and timing against the FPGA package, and must complete static timing analysis for the 500 MHz listed internal frequency rather than treating it as a guaranteed I/O rate.
Recommended
Data Acquisition and Instrumentation
XC6SLX45-2FG484C is suitable for parallel data-acquisition front ends that require real-time sampling, triggering, filtering, and data packing without a processor bottleneck. Its 43,661 logic elements can implement parallel acquisition pipelines, digital filters, counters, and control sequences, while 2.04 Mbit of embedded memory can buffer samples between acquisition and transfer stages. The 316 I/O sites allow direct connection to compatible digital sources and control logic. For instrumentation requiring precise external timing, use the FPGA to synchronize multiple channels and manage data-ready signals. Signal integrity, input thresholds, acquisition timing, and supported I/O standards must be validated at the board level, especially where analog converters are driven through high-speed interfaces.
Recommended
High-Speed Embedded Storage and Data Control
XC6SLX45-2FG484C can implement deterministic storage controllers, data sorters, or buffer managers where parallel logic must coexist with a memory interface. Its 6,822 ALMs and 2.04 Mbit of embedded memory offer a substantial programmable resource pool for address generation, ECC handling, burst sequencing, and read/write arbitration. The 316 I/O sites provide connections to compatible memory and data-processing components, while the -2 speed grade supports timing-oriented designs when properly constrained. Embedded-memory capacity should not be confused with external memory bandwidth; the achieved rate depends on the selected I/O standard, board topology, package assignment, and timing margin. Designers should also check whether dedicated hard memory controllers or an external controller provides a simpler implementation.
Recommended
Consumer and Automotive Infotainment Bridging
XC6SLX45-2FG484C can support programmable video, display, audio-data, or legacy-interface bridging in commercial infotainment prototypes. Its 43,661 logic elements allow several protocol engines and control paths to operate concurrently, and the listed 316 I/O sites provide broad connectivity for display timing, control signals, and external transceiver links. The commercial 0°C to 85°C range supports typical indoor environments, but it does not by itself establish suitability for harsh automotive locations. An automotive program should use the specifically qualified device and package variant identified in the manufacturer ordering guide. Power, EMC, video timing, and connector-routing requirements remain system-level constraints that must be tested before production use.
Recommended
High-Rate Communication Interface Consolidation
XC6SLX45-2FG484C is useful when several narrow communication interfaces need consolidation into a higher-bandwidth parallel data path. The FPGA’s 43,661 logic elements can host transmit and receive state machines, while its 2.04 Mbit of embedded memory supports packet buffering and clock-domain-crossing queues. A listed 500 MHz internal frequency provides a strong basis for parallel processing, but external interface rates remain dependent on I/O standards and timing closure. The 316 I/O sites permit organized placement of source-synchronous interfaces, although high-speed channels require careful package assignment and PCB layout. Clocking, impedance, return paths, and transceiver enable sequencing must be validated together to prevent intermittent communication errors.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX45-2FG484C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX45-2FG484I | XC6SLX45-3FG484I |
|---|---|---|---|
| Package | 484-pin FBGA, 15 x 15 mm | 484-pin FBGA, same package class | 484-pin FBGA, same package class |
| Brand | AMD | AMD | AMD |
| Device Series | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Elements | 43,661 LE | 43,661 LE | 43,661 LE |
| Adaptive Logic Modules | 6,822 ALM | 6,822 ALM | 6,822 ALM |
| Embedded Memory | 2.04 Mbit | 2.04 Mbit | 2.04 Mbit |
| Speed Grade | -2 | -2 | -3 |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C per verified LoveChip comparison | 0°C to 85°C per verified LoveChip comparison |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
Key Differentiators
- Preserves the target’s -2 performance grade (vs XC6SLX45-3FG484I)
- Matches the verified commercial 0°C to 85°C range (vs XC6SLX45-2FG484I)
- Matches the Spartan-6 LX resource profile (vs XC6SLX45-2FG484I)
Design Notes
Do not release the layout from the generic 484-pin name alone. The verified source records alternate between XC6SLX45-2FG484C and XC6SLX45-2FGG484C, while other listings describe a 484-pin CSBGA designation with 324 pins. Download the package drawing associated with the exact ordering code, compare every ball location, and confirm the exposed-pad treatment. A mechanical match alone does not establish that power, ground, configuration pins, and user I/O have the same electrical assignments.
Plan the power rails from the exact device family datasheet and the selected package rather than using the listed 1.2 V core value alone. Decouple each supply domain according to the manufacturer’s recommended capacitance and placement, and provide clean auxiliary rails for configuration and internal voltage regulators where applicable. The supplied results do not include a complete power-up sequence or current-consumption table, so those values must remain marked as required design inputs until verified from the official documentation.
A speed-grade substitution changes more than marketing performance. Before using XC6SLX45-3FG484I in place of the -2 target, re-run synthesis, place-and-route, and static timing analysis, then verify configuration, I/O, power, and thermal behavior. The verified results do not provide the full -2-versus--3 timing or power table. Also verify the meaning of the I suffix against the AMD/Xilinx ordering guide rather than relying on distributor pages that use inconsistent FG, FGG, CSG, and package descriptions.
Assign high-speed interfaces to banks with suitable I/O capability and keep external drivers close to the corresponding FPGA pins. Use the manufacturer’s clocking and pin-placement guidance, control trace impedance on the PCB, and provide continuous return paths. Because the verified data lists 500 MHz as an internal frequency rather than a guaranteed I/O rate, external interface timing must be evaluated at the actual pin and board level. Bank-voltage compatibility also applies to every attached transceiver or converter.
Compliance Information
The verified FindIC record identifies the device as lead-free, but the supplied data does not explicitly establish RoHS, REACH, halogen-free, AEC-Q100, or conflict-minerals status. The commercial C ordering suffix is not, by itself, evidence of AEC-Q100 qualification.
