XC6SLX75-2FGG484C vs XC6SLX45-2FGG484I Comparison

Detailed side-by-side comparison of XC6SLX75-2FGG484C by AMD and XC6SLX45-2FGG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX75-2FGG484C XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG484C ✓ Active

Specification Comparison

Parameter XC6SLX75-2FGG484C XC6SLX45-2FGG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA —
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 43,661
Configurable Logic Blocks 5,831 CLBs —
I/O Count 280 I/O —
Internal Frequency 667 MHz —
Process Technology 45 nm CMOS 45 nm low-power CMOS
Package Type FBGA-484 —
Package Dimensions 23 mm x 23 mm 23 x 23 mm, 1.0 mm ball pitch
Package Pitch 1 mm —
Pin Count 484 pins —
Operating Temperature 0 °C to 85 °C —
Speed Grade -2 -2
Temperature Grade Code C —
Mounting Type Surface Mount —
Programmable Logic Technology 45 nm CMOS —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Family — Spartan-6 LX
Logic Slices — 6,822
Flip-Flops — 54,576
Block RAM — 2,138,112 bits (2,088 Kb/s)
DSP Slices (DSP48A1) — 58
Maximum User I/O — 316
Package — 484-ball BGA (FBGA-484)
Operating Temperature (I grade) — -40C to +100C (industrial)
Supply Voltage Core — 1.2 V typical
Clock Management Tiles — 6 CMT (4 DCM + 2 PLL)
Maximum I/O Speed — 800 Mbps LVDS
Memory Interface Support — DDR, DDR2, DDR3, LPDDR
Configuration Memory — AES-256 bitstream encryption
RoHS Compliance — Lead-free / RoHS compliant

Datasheets & Resources

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